Nec Corporation

Jun-ichi Sasaki

Takanori Shimizu

Kazuhiko Kurata

Toshitaka Torikai

Hiroshi Honmou

Masataka Itoh

Takara Sugimoto

On the back surface of a transparent plate having a light extracting part for outputting lights to the outside, an electrode for wiring, and an electrode for an electromagnetic shield, an optical device is flip-chip mounted right under the light extracting part, an a driver IC is flip-chip mounted at a desired position with metal bumps. When currents driving the optical device flow from the driver IC according to an electric logical signal from the outside, an optical signal is emitted from the optical device, and is output to the outside through the light extracting part. The light extracting part may be provided with a light coupling material or an optical axis converter.

Optoelectronic hybrid integrated module and light input/output apparatus having the same as component

An optical module has an optical wave-guide structure formed on a silicon substrate and a laser diode array solder bonded to first pads patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.

Optical module having self-aligned optical element and optical

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Tokyo, Japan

Jun-ichi Sasaki