Samsung Electro-mechanics Co., Ltd.

Other

Jun Hyeong Kim

Myung Jun Park

Kyu Ha Lee

Eui Hyun Jo

Eun Joo Choi

Ha Jeong Kim

Byung Jun Jeon

Woo Kyung Sung

Jin Soo Park

Kang Ha Lee

Kyu Sik Park

Kyoung No Lee

Seung Hee Yoo

Jong Ho Lee

Hyun Hee Gu

Sim Chung Kang

Eun Jin Kim

Chul Seung Lee

Yoo Jeong Lee

Chung Yeol Lee

Hyung Jong Choi

Kwang Yeun Won

Kangha Lee

So Jung An

Byung Woo Jeon

Yeon Song Kang

Eun Me Park

Jin Yeop Yoo

Jong Ryeong Kim

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

Multilayer electronic component

An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.

Multilayer electronic component having improved electrode structure for increased capacity per unit volume

A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.

Ceramic electronic component and method of manufacturing the same

There is provided a multilayer ceramic electronic component including: a ceramic body in which internal electrodes containing a first electrode material and dielectric layers are alternately disposed; external electrodes provided on outer surfaces of the ceramic body and containing a second electrode material; and diffusion parts each disposed to be connected to one end of the internal electrode and the external electrode and containing the first electrode material and the second electrode material mixed with each other, wherein the diffusion part includes an internal diffusion portion disposed within the ceramic body and an external diffusion portion protruding outside of the ceramic body.

Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic capacitor and manufacturing method therefor, in which the capacitor includes a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.

Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon

A tablet supplying and packaging system comprises a tablet packaging unit having an upper portion, a base cabinet on top of the upper portion. The base cabinet defined by front, rear surfaces and side ends. One of the side ends is swingably engaged to the tablet packaging unit. One or more slider cabinets each defined by longer side surfaces and shorter side surfaces are horizontally aligned in rear of the base cabinet such that each longer side surface becomes perpendicular to the rear surface of the base cabinet. The slider cabinets are linearly slidable to move back and forth so the slider cabinet sliding can be effected when the base cabinet is swung open, whereby the slider cabinets are selectively pulled out through a space reserved by opening the base cabinet.

Tablet cassette assembly with slider cabinets for automatic tablet dispensing and packaging system

A tablet dispensing and packaging system includes a drum unit accommodating tablet cassettes open to tablet channels. A base tray slides in and out underneath the drum unit. First openings are formed through upper and lower surfaces of the base tray and a first membrane having pores is slidably provided on the lower surface. A removable tray has second openings therethrough a second membrane having pores is slidably provided on the lower surface of the removable tray to either keep tablets in the second openings thereby or drop the tablets through the pores thereof when slidably displaced to a predetermined extent. The removable tray is detachably mountable on the slid-out base tray.

Tablet dispensing and packaging system

A tablet dispensing and packaging system comprises a safety cutter having a cam disk, a cam shaft eccentric to the disk, an upper support rod, upper and lower blades each having a cutting edge. The lower rod rear end is rotatably carried on the cam shaft, the upper rod has a substantially elongated through-opening near the rear end thereof. A protrusion extends from the upper rod rear end. The through-opening is worn on the cam shaft over the lower support rod, wherein the upper blade rear end is rotatably engaged to the upper rod front end. A pin pivotably carries thereon the lower blade rear end and mid rear portion adjacent to its rear end into a frame. An elastic member elastically administers the cam shaft and the rear end protrusion of the upper support rod.

Growing community of inventors

Gyunggi-do, South Korea

Jun Hyeong Kim