Samsung Electronics Co., Ltd.

Jun Ho Seo

Jae-Seung Hwang

Taek Kyun Shin

Jung Hun Heo

Dong-won Kim

Yong-Sun Ko

Min-sang Kim

Ji-myoung Lee

Keun-Hwi Cho

Yong-Hyun Kwon

Hyun-Jun Bae

Jae-Kyu Ha

Weonwi Jang

Sung-Il Cho

Chang-jin Kang

Jong-Heui Song

Sung-il Cho

Young-Mi Lee

Min-Chul Chae

Eun-Young Kang

Jong-heui Song

Sang-joon Park

An application processor and a system on chip (SoC) that incorporates the application processor are provided. The application processor includes a first core configured to process first data per unit time, a second core configured to process second data larger than the first data per unit time, and a lookup table configured to determine whether to activate the first core or the second core based on at least one of an analysis result of a message signal received by a communications processor, a sensing signal supplied to the application processor and a power level supplied to the communications processor.

Application processor that performs core switching based on modem data and a system on chip (SOC) that incorporates the application processor

Application processor that performs core switching based on modem data and a system on chip (SoC) that incorporates the application processor

A memory device includes a storage node, a first electrode, and a second electrode formed in a memory cell, the storage node stores electrical charges, the first electrode comprising a first portion electrically connected to a second portion, the first portion moves to connect to the storage node when the second electrode is energized.

Electromechanical switch and method of forming the same

A method of manufacturing a semiconductor device having buried gates may include forming a stacked structure of sequentially stacked first mask patterns and second mask patterns with equal widths to expose active regions and isolation regions of a semiconductor substrate. After forming reduced first mask patterns by decreasing the width only of the first mask patterns, trenches may be formed in the active regions and the isolation regions by etching the exposed portions of the semiconductor substrate using the second mask patterns as an etch mask. Then, gate insulating films may be formed on inner walls of the trenches in the active regions, and a conductive material may be buried into the trenches in the active regions and the isolation regions to form gates.

Method of manufacturing semiconductor device having buried gate

In a phase change memory, an interlayer insulating layer is disposed on a substrate. A heater plug includes a lower portion disposed in a contact hole penetrating the interlayer insulating layer and an upper portion protruding upward over the top surface of the interlayer insulating layer. A phase change pattern is disposed on the interlayer insulating layer to cover the top surface and the side surface of the protruding portion of the heater plug. An insulating spacer is interposed between the phase change pattern and the side surface of the protruding portion of the heater plug. A capping electrode is disposed on the phase change pattern.

Phase change memory devices and methods for fabricating the same

In a thin layer structure and a method of forming the same, a first preliminary insulation pattern is formed on a substrate and includes a first opening exposing the substrate. One or more preliminary seed patterns including single crystalline silicon are formed in the first opening. A second insulation layer is formed on the first preliminary insulation pattern and the one or more preliminary seed patterns. A second insulation pattern, a first insulation pattern and one or more seed patterns are formed by etching the first and second insulation layers and the one or more preliminary seed patterns. The second insulation pattern includes a second opening having a flat bottom portion. A single crystalline silicon pattern is formed in the second opening, wherein a central thickness of the single crystalline silicon pattern is substantially identical to a peripheral thickness thereof, thereby reducing or preventing a thinning defect in a semiconductor device.

Thin layer structure and method of forming the same

A double pattern method of forming a plurality of contact holes in a material layer formed on a substrate is disclosed. The method forms a parallel plurality of first hard mask patterns separated by a first pitch in a first direction on the material layer, a self-aligned parallel plurality of second hard mask patterns interleaved with the first hard mask patterns and separated from the first hard mask patterns by a buffer layer to form composite mask patterns, and a plurality of upper mask patterns in a second direction intersecting the first direction to mask selected portions of the buffer layer in conjunction with the composite mask patterns. The method then etches non-selected portions of the buffer layer using the composite hard mask patterns and the upper mask patterns as an etch mask to form a plurality of hard mask holes exposing selected portions of the material layer, and then etches the selected portions of the material layer to form the plurality of contact holes.

Method of forming fine patterns using double patterning process

A method for forming a self-aligned contact hole includes forming a plurality of conductive structures on a semiconductor substrate, each conductive structure including a conductive film pattern and a protection pattern formed on the conductive film pattern, forming a first insulation film to fill a space between adjacent conductive structures, successively etching the first insulation film and the protection patterns until each of the protection patterns has an exposed level upper surface, forming a second insulation film on the resultant structure, and selectively etching portions of the second insulation film and the first insulation film using a photolithography process to form the self-aligned contact hole exposing a portion of the semiconductor substrate between adjacent conductive structures. Process failures generated during formation of a self-aligned contact hole can thus be prevented because a nitride pattern capping a conductive film pattern remains, thereby enhancing reliability and yield of a semiconductor device.

Method for forming a self-aligned contact hole in a semiconductor device

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Suwon-si, South Korea

Jun Ho Seo