Moda-Innochips Co., Ltd.

Innochips Technology Co., Ltd.

Jun Ho Jung

In Kil Park

Gyeong Tae Kim

Seung Hun Cho

Ki Joung Nam

Jung Gyu Lee

Tae Hyung Noh

Sang Jun Park

Ki Bum Kwon

Sung Il Park

Sung Cheol Park

Seung Hwan Lee

Ki Beom Kwon

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation layer disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a magnetic pulverized material and an insulation material.

Power inductor

Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.

Coil pattern, method for forming same, and chip device including same

Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

Coil pattern and formation method therefor, and chip element having same

Provided is a power inductor. The power inductor includes a body, at least one base material disposed within the body, at least one coil pattern disposed on at least one surface of the base material, an insulation film disposed between the coil pattern and the body, and an external electrode disposed outside the body and connected to the coil pattern. The body includes a plurality of magnetic layers and insulation layers, which are alternately laminated.

In accordance with an exemplary embodiment, a power inductor includes a body, a base disposed in the body, and a coil pattern disposed on at least one surface of the base, in which the body includes metal powder, a polymer, and a thermal conductive filler and the base is formed by bonding a copper foil to both surfaces of a metal plate comprising iron.

The present disclosure provides a power inductor, which includes a body, at least one substrate provided inside the body, at least one coil pattern provided on at least one surface of the substrate, and an insulation layer formed between the coil pattern and the body, wherein the insulation layer is formed of parylene.

The present invention suggests a power inductor comprising: a body; at least one substrate provided on the inside of the body; at least one coil pattern provided on at least one surface of the substrate; and an insulating layer formed between the coil pattern and the body, wherein at least a part of the substrate is removed and the body is filled in a region where the substrate is removed.

In accordance with an exemplary embodiment, a power inductor includes a body, at least two bases disposed in the body, a plurality of coil patterns disposed on at least one surface of the at least two the base, respectively, and a connection electrode disposed on an outer portion of the body and connecting the at least two coils to each other.

Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

Power inductor and method for manufacturing the same

Provided is a sensor including an insulating layer, at least two heater patterns separated in one direction in the insulating layer and electrically connected to each other, at least two sensing electrode patterns insulated form the heater patterns, separated in the one direction in the insulating layer, and electrically connected to each other, and a sensing material, at least a part of which is buried in the insulating layer to contact the sensing electrode patterns.

Growing community of inventors

Siheung-si, South Korea

Jun Ho Jung