Samsung Electro-mechanics Co., Ltd.

Jun-Heyoung Park

Jee-Soo Mok

Ki-Hwan Kim

Sung-Yong Kim

Dong-Jin Park

Eung-Suek Lee

Jun-Oh Hwang

Sung-Young Kim

Kyung-Ah Lee

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

Printed circuit board and manufacturing method thereof

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Method of manufacturing a printed circuit board

A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.

Manufacturing method for printed circuit board

A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Growing community of inventors

Hwaseong-si, South Korea

Jun-Heyoung Park