Samsung Electronics Co., Ltd.

Jun Heyoung Park

Gun Goo Lee

Woon Chun Kim

Ji Hye Shim

Sung Keun Park

A semiconductor package includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and electrically connected to the one or more redistribution layers, an encapsulant disposed on the connection structure and covering at least a portion of the semiconductor chip, and a shielding structure covering at least a portion of the encapsulant. The shielding structure includes a conductive pattern layer having a plurality of openings, a first metal layer covering the conductive pattern layer and extending across the plurality of openings, and a second metal layer covering the first metal layer. The second metal layer has a thickness greater than a thickness of the first metal layer.

Semiconductor package and electromagnetic interference shielding structure for the same

A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layeraM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.

Growing community of inventors

Yongin-si, South Korea

Jun Heyoung Park