Growing community of inventors

Portland, OR, United States of America

Jun He

Average Co-Inventor Count = 3.56

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 146

Jun HeJose A Maiz (6 patents)Jun HeYing Zhou (6 patents)Jun HeMark T Bohr (5 patents)Jun HePeter K Moon (5 patents)Jun HeKevin Fischer (5 patents)Jun HePatrick R Morrow (4 patents)Jun HeGuanghai Xu (4 patents)Jun HeQing Ma (3 patents)Jun HePaul B Fischer (3 patents)Jun HeJihperng Leu (3 patents)Jun HeSridhar Balakrishnan (3 patents)Jun HeZhanping Chen (3 patents)Jun HeSatish Radhakrishnan (3 patents)Jun HeGregory F Taylor (2 patents)Jun HeFay Hua (2 patents)Jun HeSubhash M Joshi (2 patents)Jun HeDustin P Wood (2 patents)Jun HeHyun-Mog Park (2 patents)Jun HeTatyana N Andryushchenko (2 patents)Jun HeZhiyong Ma (2 patents)Jun HeJeffrey Hicks (2 patents)Jun HeKevin O'Brien (1 patent)Jun HeMauro J Kobrinsky (1 patent)Jun HeKevin X Zhang (1 patent)Jun HeKevin J Lee (1 patent)Jun HeShriram Ramanathan (1 patent)Jun HeMartin D Giles (1 patent)Jun HeSteven N Towle (1 patent)Jun HeMakarem A Hussein (1 patent)Jun HeThomas N Marieb (1 patent)Jun HeSusanne Menezes (1 patent)Jun HeRose Mulligan (1 patent)Jun HeXianghong Tong (1 patent)Jun HeKevin D Johnson (1 patent)Jun HeBinny Arcot (1 patent)Jun HeGerald S Leatherman (1 patent)Jun HeTom P Leavy (1 patent)Jun HeTatyana T Adryushchenko (1 patent)Jun HeJun He (27 patents)Jose A MaizJose A Maiz (21 patents)Ying ZhouYing Zhou (17 patents)Mark T BohrMark T Bohr (164 patents)Peter K MoonPeter K Moon (31 patents)Kevin FischerKevin Fischer (27 patents)Patrick R MorrowPatrick R Morrow (188 patents)Guanghai XuGuanghai Xu (4 patents)Qing MaQing Ma (150 patents)Paul B FischerPaul B Fischer (110 patents)Jihperng LeuJihperng Leu (28 patents)Sridhar BalakrishnanSridhar Balakrishnan (17 patents)Zhanping ChenZhanping Chen (17 patents)Satish RadhakrishnanSatish Radhakrishnan (3 patents)Gregory F TaylorGregory F Taylor (53 patents)Fay HuaFay Hua (47 patents)Subhash M JoshiSubhash M Joshi (43 patents)Dustin P WoodDustin P Wood (29 patents)Hyun-Mog ParkHyun-Mog Park (25 patents)Tatyana N AndryushchenkoTatyana N Andryushchenko (10 patents)Zhiyong MaZhiyong Ma (9 patents)Jeffrey HicksJeffrey Hicks (6 patents)Kevin O'BrienKevin O'Brien (96 patents)Mauro J KobrinskyMauro J Kobrinsky (92 patents)Kevin X ZhangKevin X Zhang (54 patents)Kevin J LeeKevin J Lee (44 patents)Shriram RamanathanShriram Ramanathan (35 patents)Martin D GilesMartin D Giles (34 patents)Steven N TowleSteven N Towle (28 patents)Makarem A HusseinMakarem A Hussein (28 patents)Thomas N MariebThomas N Marieb (16 patents)Susanne MenezesSusanne Menezes (6 patents)Rose MulliganRose Mulligan (4 patents)Xianghong TongXianghong Tong (4 patents)Kevin D JohnsonKevin D Johnson (4 patents)Binny ArcotBinny Arcot (2 patents)Gerald S LeathermanGerald S Leatherman (2 patents)Tom P LeavyTom P Leavy (1 patent)Tatyana T AdryushchenkoTatyana T Adryushchenko (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (27 from 54,664 patents)


27 patents:

1. 9984922 - Interconnects having sealing structures to enable selective metal capping layers

2. 9461010 - Debond interconnect structures

3. 9437545 - Interconnects having sealing structures to enable selective metal capping layers

4. 9269686 - Debond interconnect structures

5. 8928125 - Interconnects having sealing structures to enable selective metal capping layers

6. 8704336 - Selective removal of on-die redistribution interconnects from scribe-lines

7. 8637778 - Debond interconnect structures

8. 8368171 - Methods of forming electromigration and thermal gradient based fuse structures

9. 8331186 - Fuse programming schemes for robust yield

10. 8242831 - Tamper resistant fuse design

11. 8058710 - Interconnects having sealing structures to enable selective metal capping layers

12. 7889587 - Fuse programming schemes for robust yield

13. 7889013 - Microelectronic die having CMOS ring oscillator thereon and method of using same

14. 7679145 - Transistor performance enhancement using engineered strains

15. 7662674 - Methods of forming electromigration and thermal gradient based fuse structures

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