Murata Manufacturing Co., Ltd.

Jun Harada

Satoru Noda

Shunjiro Imagawa

Norio Sakai

Hideaki Yamada

Satoshi Ishino

Hiroshi Takagi

Shinichi Kobayashi

Manabu Sumita

Hiroyuki Kishishita

Yoshihiko Nishizawa

Osamu Yamaoka

Katsuro Hirayama

Yuki Yamamoto

Kazunari Kawabata

Katsumi Yukawa

Hiroshi Nagakubo

Hideomi Kurihara

Hisao Yuasa

In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.

Electronic component including a shielding metal film disposed on a resin layer

A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Composite electronic component

A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

Ceramic multilayer substrate

Method of manufacturing composite electronic component

Disclosed herein is a piezoelectric sounding body comprising a piezoelectric substrate, an electrode film provided on its surface and a vibrating plate provided on the electrode film through an adhesion layer so as to conduct with the electrode film. The adhesion layer is prepared from an ultraviolet setting type anaerobic adhesive containing 0.1 to 1.0 percent by weight of carbon particles of 1.0 to 20.0 .mu.m in mean particle diameter.

Piezoelectric sounding body

In a trimmer capacitor comprising a stator having a stator electrode, a rotor having a rotor electrode and a shaft holding the rotor in a rotatable manner with respect to the stator, the stator is formed of resin containing a dielectric ceramic material. The stator electrode is located in the interior of the stator, so that the stator electrode is opposed to the rotor electrode through a dielectric layer which is defined by an integral part of the stator. The stator, the stator electrode and the dielectric member which are required for the trimmer capacitor are entirely integrated with each other in the stator, whereby the trimmer capacitor can be easily assembled. The resin, containing the dielectric ceramic material, forming the dielectric layer is superior in shock resistance to a ceramic material, whereby no problem of cracking etc. occurs even if the thickness of the dielectric layer is reduced.

Trimmer capacitor

This invention is to provide a composite material for dielectric lens antennas which contains 3-70 percent by volume of a high dielectric constant ceramic and 30-97 percent by volume of a macromolecular material. At this time it is desirable that the mean particle diameter of the high dielectric constant ceramic is 1-50 .mu.m. It is also preferable that the macromolecular material is a thermoplastic macromolecular material. A dielectric lens is made of this composite material for the dielectric lens antennas. Further, the dielectric lens antenna is preferably produced forming a matching layer on the dielectric lens surface.

Composite material for dielectric lens antennas

A feed-through capacitor in which a composite dielectric layer made of a mixed material containing a resin material and dielectric material powder is arranged between a feedthrough terminal and an outer electrode terminal surrounding this feedthrough terminal, a capacitance being formed between the feedthrough terminal and the outer electrode terminal.

Feed-through capacitor

Growing community of inventors

Yasu, Japan

Jun Harada