Sensata Technologies, Inc.

Jun H Bae

Mark W McBrine

Shuo Robert Chen

Nikhil B Lal

Frank Morsink

Guanshi Li

Gerald Spijksma

Tom Te Boekhorst

Andrew C Herron

David T Brown

Sean P Mulligan

A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.

Overmolded lead frame assembly for pressure sensing applications

A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.

Integrated pressure and temperature sensor

A pressure sensor module is disclosed. The pressure sensor module comprises a sensing element () mounted on a front side () of a support member (). The support member () comprises a hole () through the support member () from the front side () to a back side (). The sensing element () covers the hole () at the front side (). A back side barrier () provided at the back side () of the support member () surrounds a surface of the back side () of the support member () and forms an enclosed area (), wherein the enclosed area () and the hole () form a pressure channel (). A back side protective member () fills the hole () and at least partially the enclosed area (). The support member (), back side barrier () and back side protective member () form a module that can be placed during production of the pressure sensor in a housing of the pressure sensor.

Pressure sensor for measuring pressure in a medium

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Medfield, MA, United States of America

Jun H Bae