Samsung Electronics Co., Ltd.

Jun Gul Hwang

Gun Goo Lee

Sung Keun Park

Ji Eun Woo

A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.

Growing community of inventors

Suwon-si, South Korea

Jun Gul Hwang