Nhk Spring Co., Ltd.

Other

Jun Futakuchiya

Toshihiro Tachikawa

Naoya Kida

Daisuke Hashimoto

Shinya Miyaji

Junichi Miyahara

Takashi Masaki

Hidenori Ishiwata

Shinji Saito

Toshihiko Hanamachi

Satoshi Hirano

Noriyoshi Kaneda

Go Takahara

Yasuaki Ishioka

Naoki Ito

Kenzo Yasuda

Tsutomu Amakawa

Yohei Itami

Toshihiro Sugisawa

Hibiki Yokoyama

Michiyoshi Sone

Kazuhiro Yonekura

A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.

Stage and manufacturing method thereof

A method of manufacturing a laminate in which a spray coating film made of a material different from a base material is laminated on the base material includes: a base material heating step of heating the base material; an intermediate layer forming step of forming, on a surface of the heated base material, an intermediate layer made of a material different from the base material and the spray coating film; and a spray coating film forming step of forming the spray coating film on a surface of the intermediate layer.

Method of manufacturing laminate and laminate

A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.

Substrate support device

A substrate supporting apparatus includes a plate member of an aluminum alloy having a flat upper surface, bottomed pits formed in the plate member, and spacer members held in the pits, individually. The spacer members are sapphire spheres. The diameter of each spacer member is a little smaller than that of each pit. The upper end of each spacer member projects from the upper surface of the plate member. A spot facing is formed in a region that includes the open edge portion of the pit. A bending portion which is obtained by plastically deforming the open edge portion of the pit toward the spacer member is formed on a bottom surface of the spot facing. A V-shaped groove is formed behind the bending portion.

Substrate supporting apparatus

The present invention provides a heater unit which can improve temperature uniformity of a heated object at the time of heating the object. A second heat conductorwhich is the radial internal part of shafthas a lower heat transfer ratio than a first heat conductorwhich is the radial external part of shaft. As a result, in the case where a heated state and a non heated state of the resistance heating elementare repeatedly switched, the movement of heat from the front partB of the shaftto the base point partA is suppressed by the second heat conductorcompared to the first heat conductor. As a result, in the part which confronts the hollow partof the shaftin the heater plate, the time required to heat the heater plateand the waferto be heated to a desired heating temperature is shortened when compared to a conventional heater unit. Therefore, it is possible to improve the uniformity of the temperature of the waferwhich is to be heated by the heater plate

Heater unit

A heater unit has a heater plate including a resistive heat generator, and a hollow shaft portion of a short type with a length of 20 to 50 mm, which is provide on the side of the lower face of the heater plate. The shaft portion is made from aluminum alloy. The bottom face of the shaft portion is fixed to a heater mounting portion of a casing. A sealing member is provided between the bottom face of the shaft portion and the casing. The thickness of the shaft portion is set to 0.5 to 5.0 mm, and the length, area of heat-transfer surface, and material of the shaft portion are selected such that the thermal resistance Rof the shaft portion is 0.4 K/W or more.

In a heater unit, comprising a lower metallic base, an upper metallic base placed closely over an upper surface of said lower base, and a resistance heater wire received in a groove defined between opposing surfaces of said lower and upper bases, ceramic powder is filled in said groove to keep said heater wire at least away from a wall surface of said groove. Thus, the heater wire can be directly installed in the groove of the base without the intervention of a sheath pipe so that the heater wire can be bent in a desired dense pattern, and the heater unit can be heated both rapidly and uniformly. Also, the ceramic powder filled in the groove improves the heat transfer, and this even further enhances the these advantages of the present invention.

Heater unit for semiconductor processing

An upper metallic base is placed over a lower metallic base with a resistance heater element interposed between them so as to cause a plastic deformation to at least one of the opposing surfaces until the corresponding surfaces conform to an outer profile of the heater element, and the opposing surfaces of the lower and upper bases, and the resistance heater element are substantially entirely bonded to one another by a metallic bonding which may consist of brazing, soldering or diffusion bonding. Because the metallic bonding provides a favorable heat conduction, and can thereby improve the thermal efficiency and prevent local heating, a rapid temperature rise and uniform heating are made possible. Because the base consists of two parts, the material for the base can be selected from a wide range of materials including those capable of withstanding high temperatures and corrosive materials.

Growing community of inventors

Isehara, Japan

Jun Futakuchiya