Showa Denko K.k.

Resonac Corporation

Jun Dou

Hiroshi Uchida

Masahiko Toba

Yoshitaka Ishibashi

Masumi Kuritani

Chika Yamashita

Hideyuki Kurihara

Saki Mouri

Shoichiro Wakabayashi

Takahiko Ono

There is provided a method of producing boron trichloride, in which damage to a reaction container is inhibited. The method of producing boron trichloride includes performing reaction between chlorine gas in a gas containing the chlorine gas and particulate boron carbide () in a state in which the boron carbide () flows in the gas containing the chlorine gas.

Method of producing boron trichloride

A method for producing a polyurethane according to the present invention including: a first step wherein an epoxy carboxylate compound (X) is obtained by reacting (a) an epoxy compound that includes a halogen atom content of 10 ppm by mass or less, while having only two epoxy groups and no hydroxyl group in each molecule, (b) an unsaturated aliphatic monocarboxylic acid that has an ethylenic unsaturated group in each molecule, while having no aromatic ring, and (c) an aromatic monocarboxylic acid that has no ethylenic unsaturated group in each molecule; and a second step wherein the epoxy carboxylate compound (X) obtained in the first step is reacted with a diisocyanate compound (Y).

Method for producing polyurethane, epoxy carboxylate composition, polyurethane, and polyurethane resin composition

An epoxy (meth)acrylate compound represented by general formula (1): where at least one of Rto Rhas a structure represented by formula (2): * denotes the bonding position to a carbon atom that constitutes the benzene ring to which Rto Rare bonded in formula (1), Rdenotes a hydrogen atom or a methyl group, the remainder of Rto Rare each independently selected from the group consisting of hydrogen atoms, alkyl groups and alkoxy groups having 1-6 carbon atoms, and Rdenotes a hydrogen atom or a methyl group. In the epoxy (meth)acrylate compound, the content of halogen atoms is 100 ppm by mass or less. A curable composition for forming a protective film for an electrically conductive pattern obtained by mixing the epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.

Epoxy (meth) acrylate compound and curable composition containing same

Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300&#xb0; C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25&#xb0; C. being 1.0&#xd7;10to 2&#xd7;10mPa&#xb7;s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300&#xb0; C. or less and/or subjecting the pattern to pulsed light irradiation.

Conductive composition for thin film printing and method for forming thin film conductive pattern

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Tokyo, Japan

Jun Dou