Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Huawei Technologies Co., Limited

Jun Cao

Shi-Wen Zhou

Chun-Chi Chen

Peng Liu

Jianbin Liu

Er Li

Qing-Song Xu

Jie-Cheng Deng

Jiangwei Li

Huan Yun Zhang

Tizheng Wang

Bo Zheng

Ruihua Li

Zhan Wu

Yangpo Xu

Zhao Jin

Zhongwei Tang

Zongwu Wu

Yuanlin Chen

Jinxue Liu

Wensen Feng

Jiange Ge

Wei-Ping Gong

A visual localization method and apparatus are provided. The method includes obtaining a captured first image, determining a first pose based on the first image and an aerial model, determining whether a ground model corresponding to the first pose exists in an aerial-ground model, and when the ground model corresponding to the first pose exists, determining a second pose based on the ground model. The aerial-ground model includes the aerial model and the ground model mapped to the aerial model, a coordinate system of the ground model is the same as a coordinate system of the aerial model, and localization accuracy of the second pose is higher than localization accuracy of the first pose. Performing fine visual localization based on the ground model can improve accuracy and a success rate of localization.

Visual localization method and apparatus

Methods, devices, and systems for digital space management in virtual reality and augmented reality are described. A method can include a terminal that logs in to a preset application based on a first user identifier, presents a first interface, where the first interface includes a virtual space registration option. In response to an enabling operation of a user for the virtual space registration option, the terminal photographs a first scene to obtain a preview stream, obtains a target geometry, and sends the first user identifier, the preview stream, and the target geometry to a server. The preview stream and the target geometry are used to determine a target virtual space in which a user with the first user identifier has virtual content editing permission in a first virtual space. The first virtual space is a virtual space corresponding to a real world including the first scene. The target geometry is used to represent a form of the target virtual space.

Digital space management method, apparatus, and device

This application relates to the field of pose detection technologies, and discloses a method and an apparatus for obtaining pose information, a method and an apparatus for determining symmetry of an object, and a storage medium. The method includes: obtaining a rotational symmetry degree of freedom of a target object (), obtaining pose information of the target object (), and adjusting the pose information of the target object based on the rotational symmetry degree of freedom to obtain adjusted pose information (), where the adjusted pose information is used for displaying a virtual object, and the virtual object is an object associated with the target object.

Method and apparatus for obtaining pose information, method and apparatus for determining symmetry of object, and storage medium

A method, an apparatus, and a medium for determining a pose are provided. The method includes: receiving a query image sent by a terminal and N text fields included in the query image; determining a candidate reference image based on a prestored correspondence between a reference image and a text field and based on the N text fields; determining an initial pose of the terminal at the first location based on the query image and the candidate reference image; and sending the initial pose to the terminal. According to the method, a candidate reference image is queried based on a text field, and an initial pose of a terminal is obtained based on a candidate reference image with higher accuracy. Therefore, the obtained pose is more accurate.

Method, apparatus, and system for determining pose

A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.

Heat sink assembly and method for manufacturing the same

A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.

Heat dissipation device

A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.

A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.

Heat dissipation device having a fan for dissipating heat generated by at least two electronic components

A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.

Protective device for protecting thermal interface material and fasteners of heat dissipation device

A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink.

Heat dissipation device having a fan mounted thereon

A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink () contacting one of the electronic components, a pair of fans () attached on a lateral side of the heat sink, and a fan duct () fixed on the fans. A plurality of guiding members () are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver () to accurately fit with screws () preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.

Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board

A heat dissipation device includes a first base plate (), a fin group () arranged on the first base plate, a first heat pipe () attached on the first base plate and the fin group and a second heat pipe () attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

Heat dissipation device with heat pipes

A heat sink assembly () compatible with an ATX motherboard () and a BTX motherboard (), includes a heat sink and a plurality of fasteners () extending through the heat sink. The heat sink includes a base () defining a slot () therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.

Heat sink assembly

A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base () contacting the CPU, a heat sink () mounted on the base, a pair of fans () attached on a front side of the heat sink, and a fan duct () secured to the fans. The fan duct has a first inlet () through which a part of airflow flows into the fan duct, a second inlet () through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet () for allowing the airflow generated by the fans to blow to the heat sink.

Growing community of inventors

Shenzhen, China

Jun Cao