Murata Manufacturing Co., Ltd.

Jun Adachi

Takahiro Sumi

Takayuki Tsukizawa

Jun Urakawa

Issei Yamamoto

Katsumi Yasunaka

Takeshi Miki

Sumiyo Nakamura

Kumiko Ishikawa

Kumiko Hiehata

Takashi Noma

Takayuki Imada

Takahiro Kitadume

Mayu Suzuki

Eriko Sawada

Yoshihito Otsubo

Akihiko Kamada

Masanori Okamoto

Kosuke Yamada

Takahiro Kitazume

Hiromitsu Hongo

Hiroyuki Asano

Yoshihito Okutomi

Naganori Hirakawa

Katumi Yasunaka

An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

Electronic component and manufacturing method for the same

An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

Electronic component and manufacturing method for electronic component

An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 &#x3bc;m to about 1.5 &#x3bc;m. A density of the metal particles is greater than or equal to about 20 particles/50 &#x3bc;mand the semiconductor particles include an oxygen-containing layer on surfaces of the semiconductor particles.

Electrostatic discharge protection device and method of manufacturing the same

An ESD protection device includes first and second discharge electrodes and a discharge auxiliary electrode that is electrically connected to the first and second discharge electrodes. The first and second discharge electrodes are located on or in an insulating substrate to at least partially face each other. The discharge auxiliary electrode includes first metal particles, second metal particles, and a binding agent. The first metal particles have a core-shell structure including a core section mainly including a first metal and a shell section which mainly includes an oxide of a second metal and which includes at least one portion with a cavity. The second metal particles have a core-shell structure including a core section mainly including the first metal and a shell section which mainly includes the oxide of the second metal and which has no cavity.

ESD protection device and method for manufacturing the same

An ESD protection device includes an insulating ceramic body including a cavity, first and second discharge electrodes disposed so as to partially face each other with the cavity interposed therebetween, and a supporting electrode disposed so as to be at least partially exposed to the cavity and to be electrically connected to the first and second discharge electrodes. A void isolated from the cavity is provided in at least a portion of a boundary region between at least one of the first and second discharge electrodes, the supporting electrode, and the insulating ceramic body.

ESD protection device and method for producing the same

An electro-static discharge protection device includes a ceramic base material, first and second outer electrodes on the outer surface of the ceramic base material, a hollow portion inside the ceramic base material, a first discharge electrode including a first end portion electrically connected to the first outer electrode and a second end portion in the hollow portion, a second discharge electrode including a first end portion electrically connected to the second outer electrode and a second end portion spaced apart from the first discharge electrode in the hollow portion, and a discharge supporting electrode including silicon carbide and between the second end portion of the first discharge electrode and the second end portion of the second discharge electrode. The elemental alkali metal in the ceramic base material is about 3 percent by weight or less.

Electro-static discharge protection device

An ESD protection device includes a bare unitary body, and a first discharge electrode and a second discharge electrode that are disposed inside the bare unitary body. The first discharge electrode and the second discharge electrode are opposed to each other with a gap interposed therebetween. The bare unitary body includes a cavity in which the gap between the first discharge electrode and the second discharge electrode is located, and to which the first discharge electrode and the second discharge electrode are exposed. A first space of the cavity on a side closer to the first discharge electrode is smaller than a second space of the cavity on a side closer to the second discharge electrode.

ESD protection device and manufacturing method for same

An ESD protective device includes an element assembly with a hollow portion that includes inner surfaces including a first inner surface, a second inner surface, and a third inner surface inclined to a Z direction in a cross section including the Z direction. Accordingly, a surface area of the inner surfaces of the hollow portion is increased, the heat load on an auxiliary discharge electrode is reduced, and the deterioration of the auxiliary discharge electrode is significantly reduced or prevented.

ESD protective device and method for manufacturing thereof

An ESD protection device includes an insulating ceramic body including a cavity portion, an auxiliary electrode including a first and second main surfaces, the auxiliary electrode being embedded in the insulating ceramic body such that a side end portion of the auxiliary electrode between the first and second main surfaces is exposed to the cavity portion, and first and second discharge electrodes embedded in the insulating ceramic body such that main surfaces of the first and second discharge electrodes face each other with the auxiliary electrode interposed therebetween, the auxiliary electrode including first and second auxiliary electrode layers, the first auxiliary electrode layer having a higher content of a conductive material than the second auxiliary electrode layer, the first auxiliary electrode layer being joined to at least one of the first and second discharge electrodes.

ESD protection device

There is provided an ESD protection device that can have an advantageously low discharge inception voltage. An ESD protection device having a substrate, first and second discharge electrodes provided somewhere on the substrate with their respective distal ends facing each other with a gap therebetween, and a high-dielectric-constant layer having a relative dielectric constant higher than that of the substrate.

An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

There is provided an ESD protection device capable of lowering a discharge starting voltage. An ESD protection deviceincludes a ceramic multilayer substrate, a first discharge electrodeand a second discharge electrodearranged at a height position of the ceramic multilayer substrate, an endof the first discharge electrodeand an endof the second discharge electrodefacing each other, in which each of the first discharge electrodeand the second discharge electrodecontains a metal and a shrinkage suppression material having a lower rate of shrinkage than that of the metal at a temperature at which firing for the production of the ceramic multilayer substrateis performed.

An ESD protection device of the present disclosure includes a ceramic multilayer structure inside which a cavity portion is formed, at least one pair of discharge electrodes arranged inside the ceramic multilayer structure, and outer electrodes formed on the surface of the ceramic multilayer structure and connected to the discharge electrodes, wherein the pair of discharge electrodes are arranged in such a way that one end-face of one discharge electrode and one end-face of the other discharge electrode are opposed to each other through the cavity portion, and the cavity portion is formed as a single cavity occupying a region between the opposed end-faces, regions along other end-faces connected to the opposed end-faces via corner portions, and, on first principal surfaces, regions along the opposed end-faces and regions along the other end-faces.

An ESD protective device is provided which can lower a discharge start voltage. In an ESD protective device, first and second discharge electrodesandare disposed in a substratein a spaced relation with a discharge gap G interposed therebetween, and a conductoris arranged around the discharge gap G. The conductorhas a nonlinear sectional shape in a section of the substrateextending in a direction interconnecting a first principal surfaceand a second principal surfaceof the substrateand passing the discharge gap G.

ESD protective device

An ESD protection devicehas a ceramic insulating materialfirst and second discharge electrodesandand a discharge-assisting sectionThe first and second discharge electrodesandare disposed somewhere of the ceramic insulating materialThe discharge-assisting sectionis located between the distal end portion of the first discharge electrodeand the distal end portion of the second discharge electrodeThe discharge-assisting sectionis an electrode configured to reduce the discharge starting voltage between the first discharge electrodeand the second discharge electrodeThe discharge-assisting sectionis made from a sintered body containing conductive particles and at least one of semiconductor particles and insulating particles. The first and second discharge electrodes contain at least one of the semiconductor material constituting the semiconductor particles and the insulating material constituting the insulating particles.

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Nagaokakyo, Japan

Jun Adachi