Texas Instruments Corporation

Julius Lim

Mario A Bolanos

Jeremias L Libres

Ireneus J Pas

George A Bednarz

Tay LiangChee

Tay Liang Chee

Ireneus J T M Pas

A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert is placed in a rectangular receptacle in a bottom mold chase . The receptacle is coupled to a plurality of die cavities by runners . Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase such that the integrated circuit dies are each centered over a bottom mold die cavity . A top mold chase is placed over the bottom mold chase and the mold compound package . The top mold chase has die cavities corresponding to those in the bottom mold chase . The mold compound insert is preferably packaged in a plastic film which has heat sealed edges . The mold compound is forced through the package and heat seals during the molding process by the pressure applied by a rectangular plunger . The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and mining wire sweep of the bond wires of the integrated circuit assemblies.

Sproutless pre-packaged molding for component encapsulation

A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

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Johor, Malaysia

Julius Lim