Hewlett-packard Company

Agilent Technologies, Inc.

Other

Julius K Botka

Lewis R Dove

John F Casey

Joel David Bickford

Ling Liu

Rosemary O Johnson

James R Drehle

R Frederick Rau, Jr

David R Veteran

Marvin Glenn Wong

Michael T Powers

S Bruce Donecker

Floyd A Bishop

Frank E Hamlin

Jon L James

Paul B Watson

Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then 'subsintering' the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.

Methods for making microwave circuits

In a method for making a microwave circuit, a first dielectric is deposited over a ground plane, and then a conductor is formed on the first dielectric. A second dielectric is then deposited over the conductor and first dielectric, thereby encapsulating the conductor between the first and second dielectrics. In one embodiment, a ground shield layer is formed over the first and second dielectrics by 1) precoating the first and second dielectrics with a metallo-organic layer, and then 2) depositing a thickfilm ground shield layer over the precoat layer. Alternately, a ground shield layer is formed over the first and second dielectrics by 1) placing a polymer screen over the first and second dielectrics, and applying pressure to the polymer screen until it at least partially conforms to a contour of the dielectrics, and then 2) printing a thickfilm ground shield layer through the polymer screen.

Methods for making microwave circuits including a ground plane

Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.

A switch has a channel plate that defines at least a portion of a number of cavities. A switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid. A plurality of planar signal conductors extend from edges of the switch to within the one or more cavities holding the switching fluid, and are in wetted contact with the switching fluid. Corners in paths of the planar signal conductors may be limited to greater than 90&#xb0;, about 135&#xb0;, or equal to or greater than 135&#xb0;. In one embodiment, signal path corners are so limited, but the planar signal conductors do not extend to the edges of the switch. In another embodiment, the one or more cavities holding the switching fluid are at least partly defined by a bent switching fluid channel.

Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch

A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.

Bent switching fluid cavity

Asymmetric support for high frequency transmission lines. An asymmetrical support structure coaxially supports a center conductor over a ground plane using a dielectric material. Absorbing material between the dielectric and the outer conductor reduces the effects of high order modes.

Asymmetric support for high frequency transmission lines

A connector assembly includes a first connector half, and a second. The first connector half includes a first transmission line, having a first outer conductor and a first center conductor. The first center conductor has a first end that has an angled flat region. The second connector half, includes a second transmission line. The second transmission line includes a second outer conductor and a second center conductor. The second center conductor has a first end that has an angled flat region. When the first connector half and the second connector half are connected together, the first outer conductor is electrically connected to the second outer conductor. Additionally, a wiping contact is established between the angled flat region of the first end of the first center conductor and the angled flat region of the first end of the second center conductor.

Broadband coaxial microwave connector

A compressible conductive interface provides electrical continuity between a first group of contacts and a second group of contacts in the presence of a compression force applied between the groups of contacts. An insulating housing in the compressible conductive interface has one or more channels and a matrix of apertures. Compressible bars in the compressible conductive interface each have a pair of opposing sides, a base and a nose and are positioned in the channels so that the nose of the compressible bar is at a bottom of the channel into which the compressible bar is positioned. A series of conductive elements, each having a conductive frame and a conductive slider, are also included in the compressible conductive interface. Each conductive element of the compressible conductive interface has a neutral state and a loaded state.

compressible conductive interface

The invention provides a balun capable of operation over a range including micro and millimeter wavelengths. The balun includes a set of ferrite beads, and a set of polyiron cones. The ferrite beads and polyiron cones together provide signal balancing operable across a bandwidth together provide a signal balancing operable across a range of bandwidths of about 5000 to 1.

Broad-bandwidth balun with polyiron cones and a conductive rod in a

A compliant wafer prober docking adapter provide compliant docking capability which permits a test head to be floated (to come down) to the top portion of the compliant adapter. The compliant adapter includes a compliant spring mechanism in the form of coiled springs which support a portion of the weight of the test head and wherein the upper portion of the adapter automatically aligns itself with the test head. This desirable aspect allows for all of the connectors to be seated properly, such that the locking of a cam locking mechanism provides a compliant and secure mating between the two surfaces. Also, a test head can be easily moved from one wafer prober to another, because the alignment of the adapter to the wafer is not being disturbed. Hence, the head can be moved between stations very quickly without having to go through another long and complex re-alignment process

Compliant wafer prober docking adapter

An electronic circuit tester for measuring the response to electrical signals applied to an electronic circuit under test is provided with a socket for effecting connection between a packaged device or integrated circuit being tested to a device-under-test (DUT) board incorporated into a fixture board of the tester. The socket includes an electrically insulative housing having at least one longitudinal slot and two transverse channels, an elastomeric member disposed in each of the channels and spanning the width of the slot, an electrically conductive contact frame disposed in the slot and mechanically biased by the elastomeric members against the DUT board, and an electrically conductive contact in sliding contact with the contact frame, the contact having a first end configured to electrically contact the lead of the electronic circuit with a second end of the contact being in engagement with the second elastomeric member to mechanically bias the first end of the contact against the lead of the electronic circuit. The socket increases repeatability of connections and accuracy of measurements with the electronic circuit tester.

Socket for contacting an electronic circuit during testing

An electronic circuit tester for measuring the response of electrical signals applied to an electronic circuit under test is provided with a blind mate connector for effecting connection between a test head of the electronic circuit tester and a calibration board or, alternatively, a fixture board coupled to an electronic circuit under test. The blind mate connector includes a body portion having a relieved region at one end, a coaxial center conductor, dielectric material disposed in an interstitial region for supporting the center conductor within the body portion, a coaxial sleeve disposed in the relieved region in electrical contact with the body portion, and a ring to retain the sleeve in the body portion. The blind mate connector is mounted to the calibration or fixture board and mates with a compliant female connector incorporated into the test head. The blind mate connector increases repeatability of connections and facilitates setup and calibration of, and measurements with, the electronic circuit tester.

Blind mate connector for an electronic circuit tester

An electronic circuit test system for measuring the response to electrical signals applied to an electronic circuit under test is provided with a docking system for facilitating mechanical and electrical connections. A docking cone is mounted to a fixture board of the electronic circuit test system. The docking cone enters a tunnel in a test head of the electronic circuit test system as the fixture board is moved toward the test head. The docking cone guides connectors mounted to the fixture board into connection with mating connectors mounted to a load board and a connector support disk comprising the test head. The docking system increases the repeatability and reliability of mechanical and electrical connections and reduces the risk of damage to electrical connectors of the electronic circuit test system.

Docking system for an electronic circuit tester

An electronic circuit tester for measuring the response of electrical signals applied to an electronic circuit under test is provided with a pivotable connection for conduit through which cables are routed from a test head coupled to the electronic circuit under test to the remainder of the tester. The test head includes a chassis having a relieved region in which a bracket is selectively mounted. The bracket has first and second legs disposed at a distance from one another, the first and second legs each being provided with an approximately circular hole to provide a bearing surface for pivotable movement. A fitting having first and second approximately tubular arms extending outwardly from an integral transversely depending conduit portion is connected to the chassis with each of the first and second arms rotatably captured in the holes of the respective first and second legs of the bracket when the bracket is mounted to the chassis. Finally, a conduit is selectively connected to the conduit portion of the fitting for routing cables. Strain relief is additionally provided at the interconnection of the cables to circuitry in the test head. Also, cooling air can be supplied through the conduit to the circuitry in the test head.

Hinged conduit for routing cables in an electronic circuit tester

An electronic circuit tester for measuring the response of electrical signals applied to an electronic circuit under test is provided with a calibration board for effecting calibration of the tester to the plane of connectors incorporated into a test head of the tester. The calibration board includes a dielectric substrate, calibration standards, such as opens, shorts, and loads, mounted to the substrate in respective regions of the substrate, connectors for electrically connecting the calibration standards to the connectors of the test head when the calibration board is selectively substituted for a fixture board, structure for mounting the calibration board to the test head so that electrical connection is established between the calibration board and the test head, and indicia on the calibration board and the test head for indicating a sequence of rotational positions of the calibration board for calibration of the tester using the calibration standards. The calibration board is sequentially rotated to the indicated rotational positions so that the tester can be calibrated to the plane of the connectors of the test head. The calibration board can further include at least one verification standard mounted to the substrate and can alternatively include through connections.

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Santa Rosa, CA, United States of America

Julius K Botka