Stmicroelectronics S.a.

Julien Vittu

Remi Brechignac

Juan Exposito

Device comprising a camera module with automatic focusing itself comprising an optical chip () and an optical block (), the optical block () integrating at least an objective (), at least a focusing means () for adjusting the focus of the objective (), the optical chip () integrating at least an image sensor () placed on a first face of a substrate of the optical chip (). This optical chip () also includes a microprocessor () placed on the same substrate, receiving image signals originating from the image sensor () and generating a control signal based on the said image signals, that is applied to the said focusing means () to focus the objective ().

Device comprising a camera module with automatic focusing and corresponding assembly method

An optical semiconductor package includes a support with a passage to receive a ring holding a lens situated facing an optical sensor. The support has, in the passage, at least one local release recess and the ring is equipped peripherally with a locally projecting, elastically deformable element. The local release recess and the elastically deformable element are such that, when the ring occupies an angular mounting position, the locally projecting elastically deformable element is engaged in the local recess of the support and, when the ring is pivoted from the aforementioned angular mounting position, the locally projecting elastically deformable element is moved out of the recess of the support and is compressed against the wall of the passage in order to secure the ring relative to the support.

Optical semiconductor package with compressible adjustment means

A semiconductor package includes a package body containing an integrated-circuit chip having an optical sensor. The package can be fitted into an object having two parts suitable for being coupled. A board in the object is provided with electrical connection tracks. The package is placed in a position such that the optical sensor is located facing an opening in the object. The package body carries, on the one hand, resilient rear electrical connection leads that project from a rear face and are electrically connected to the said chip and has, on the other hand, a front bearing surface, such that, when the package body is fitted into the object adjacent the board and when the parts of the object are coupled, the front bearing surface of the body bears on an inner surface of a part of the object and the resilient rear leads bear resiliently on the respective electrical connection tracks of the board.

Semiconductor package with an optical sensor which may be fit inside an object

A semiconductor package includes a body having a cavity closed by a lid. In the cavity, an integrated-circuit chip is placed. Electrical connection leads are carried by the body. These leads have resilient inner terminal parts which lie in the cavity and are suitable for being in contact with electrical connection pads on the said chip. The lid acts so as to keep the said inner terminal parts of the leads in resilient contact on the electrical connection pads on the chip.

Semiconductor package

An optical semiconductor package includes an optical semiconductor component (), a front face of which has an optical sensor (), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection () of this optical semiconductor component (). The encapsulation () includes a glass pane letting light through to the optical sensor. The encapsulation () includes electromagnetic screening () made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component ().

Shielded housing for optical semiconductor component

Optical semiconductor package ( ) and process for fabricating an optical semiconductor package, in which an electrical connection support plate has a through-passage ( ); a semiconductor component ( ), a front face ( ) of which has an optical sensor and which is fixed to a rear face of the plate in such a way that its optical sensor is situated opposite the through-passage; electrical connection ( ) connects the optical component to the support plate; the component is encapsulated on the rear face of the support plate; a lid ( ), which is at least partially transparent, is fixed to a front face of the support plate and covers the through-passage; and external electrical connections ( ) are located on an exposed part of the support plate. Furthermore, another semiconductor component ( ) may be fixed to the rear face of the support plate ( ) and electrically connected, to the latter, this component also being encapsulated ( ).

Optical semiconductor housing and method for making same

Optical semiconductor package and process for fabricating an optical semiconductor package, in which an electrical connection support plate ( ) has a through-passage ( ); a first semiconductor component ( ) such as a microprocessor placed behind the support plate and lying opposite the through-passage; electrical connection metal balls ( ) inserted into the annular space separating the first component from the support plate; encapsulation mechanism including an encapsulation material ( ) lying in the annular space; a second semiconductor component ( ), a front face ( ) of which has an optical sensor and a rear face of which is fixed to the front face ( ) of the first component ( ) through the through-passage ( ) of the support plate ( ); metal electrical connection wires ( ) connecting the front face of the second component and the front face of the support plate; a front encapsulation lid ( ) which covers the through-passage and the metal wires at some distance and which has at least one transparent part ( ) lying in front of the optical sensor, and external electrical connection ( ) located on an exposed part of the support plate.

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Voreppe, France

Julien Vittu