Intel Corporation

Julien Sebot

William W Macy, Jr

Eric L Debes

Huy Van Nguyen

Yen-Kuang Chen

Minerva M Yeung

Matthew J Holliman

Johanna M Swan

Adel A Elsherbini

Aleksandar Aleksov

Shawna M Liff

Feras Eid

Rolf H Kuehnis

Matthew Long

Dmitri E Nikonov

Tanay Karnik

Stephen H Gunther

Nasser A Kurd

Edward Allyn Burton

Randy B Osborne

Gautham N Chinya

Gerald S Pasdast

Patrice L Roussel

Jonathan P Douglas

Mark J Buxton

Neelam Chandwani

Robert J Munoz

Nevine Nassif

Eric Kwesi Donkoh

Carleton L Molnar

Stephen J Tarsa

Rangeen Basu Roy Chowdhury

Joshua Een

Rustam Miftakhutdinov

Somvir Singh Dahiya

Scot Kellar

A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer between the first layer and a third layer; and a third plurality of IC dies in the third layer. In some embodiments, the second plurality of IC dies comprises IC dies in an array of rows and columns, each IC die of the second plurality of IC dies is coupled to more than one IC die of the first plurality of IC dies, and the third plurality of IC dies is to provide electrical coupling between adjacent ones of the second plurality of IC dies.

Fine-grained disaggregated server architecture

Techniques and mechanisms for mitigating stress on hybrid bonded interfaces in a multi-tier arrangement of integrated circuit (IC) dies. In an embodiment, first dies are bonded at a host die each via a respective one of first hybrid bond interfaces, wherein a second one or more dies are coupled to the host die each via a respective one of the first dies, and via a respective second hybrid bond interface. Stress at one of the hybrid bond interfaces is mitigated by properties of a first dielectric layer that extends to that hybrid bond interface. In another embodiment, stress at a given one of the hybrid bond interfaces is mitigated by properties of a dummy chip—or alternatively, properties of a patterned encapsulation structure—which is formed on the given hybrid bond interface.

Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets

In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.

System, apparatus and method for dynamic thermal distribution of a system on chip

Hybrid bonded 3D die stacks with improved thermal performance, related apparatuses, systems, and methods of fabrication are disclosed. Such hybrid bonded 3D die stacks include multiple levels of dies including a level of the 3D die stack with one or more integrated circuit dies and one or more thermal dies both directly bonded to another level of the 3D die stack.

Thermal performance in hybrid bonded 3D die stacks

A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.

Thermal management in horizontally or vertically stacked dies

An apparatus and method is described that digitally coordinates dynamically adaptable clock and voltage supply to significantly reduce the energy consumed by a processor without impacting its performance or latency. A signal is generated that indicates a long latency operation. This signal is used to reduce power supply voltage and frequency of the adaptable clock. An early resume indicator is generated a few nanoseconds before normal operations are about to resume. This early resume signal is used to power up the power-downed voltage regulator, and/or can increase frequency and/or supply voltage back to normal level before normal processor operations are about to resume.

Digitally coordinated dynamically adaptable clock and voltage supply apparatus and method

A system on a chip is described that comprises a processor and a set of memory components that store instructions, which when executed by the processor cause the system on a chip to: generate, by a set of data collectors of a telemetry subsystem, a set of streams of telemetry metadata describing operation of the processor, forward one or more streams of telemetry metadata from the set of streams of telemetry metadata to a set of machine learning-driven adaptation decision models, receive, from the set of machine learning-driven adaptation decision models, a set of configuration parameters for controlling operation of the processor based on the one or more streams of telemetry metadata, and modify operation of the processor based on the set of configuration parameters.

Reducing microprocessor power with minimal performance impact by dynamically adapting runtime operating configurations using machine learning

Method, apparatus, and program means for performing bitstream buffer manipulation with a SIMD merge instruction. The method of one embodiment comprises determining whether any unprocessed data bits for a partial variable length symbol exist in a first data block is made. A shift merge operation is performed to merge the unprocessed data bits from the first data block with a second data block. A merged data block is formed. A merged variable length symbol comprised of the unprocessed data bits and a plurality of data bits from the second data block is extracted from the merged data block.

Processor to execute shift right merge instructions

Bitstream buffer manipulation with a SIMD merge instruction

Growing community of inventors

Portland, OR, United States of America

Julien Sebot