Apple Inc.

Julien C Vittu

Nicholas D Smyth

Nitin Kumar Chennupati

Hiran R Rathnasinghe

Aurelien R Hubert

Qiang Yang

Ho Seop Jeong

Justin C Brunnett

Kevin Garrison

Reynaldo Vincent H Sta Agueda

Paulom Shah

Jeffrey P Bosco

Wai Shing Sin

A camera includes a base housing an image sensor. The base is adhered to an optics holder that holds optical components of the camera. The optics holder is located in a recess of the base component and includes a horizontal flange extending outward from an upper portion of vertical perimeter walls of the optical components holder. The horizontal flange redirects adhesive horizontally during assembly (may include an active alignment process) of the camera, and the horizontal adhesive adheres the flange to an upper horizontal ledge of the base. An exposed portion of the adhesive between the horizontal flange and the upper horizontal ledge of the base may be cured via ultraviolet light to prevent shifting of the optics holder during transport of the camera to a thermal curing process. A lower portion of a vertical interior wall of the base may include another ledge that redirects adhesive during assembly.

Robust mounting for folded optics assembly

A camera comprising: a camera enclosure; an optomechanical assembly fixedly coupled to the camera enclosure; an image sensor assembly movably coupled to the camera enclosure, the image sensor assembly comprising: a substrate, an image sensor coupled to the substrate, a flexible printed circuit board coupled to the substrate, a conductive stiffener plate coupled to the flexible printed circuit board, and a passive heat exchanger thermally coupled to the image sensor to dissipate heat away from the image sensor.

Sensor temperature reducer for a sensor shift camera architecture

A camera module may have an optical assembly, an image sensor, and a frame, where the frame includes a reinforcement member and a base member that collectively form a sidewall of the frame. The reinforcement member defines a portion of the sidewall of the frame, a peripheral edge, and an opening. The base member may define another portion of the sidewall and extend through the opening and surround the peripheral edge of the reinforcement member. The optical assembly may be coupled to the sidewall of the frame.

Camera modules with interlocked frames

Various embodiments include an engaging arrangement that may be used to attach a lens barrel to a lens carrier of a camera. In some embodiments, the engaging arrangement may restrict movement of the lens barrel relative to the lens carrier along at least an optical axis. In various examples, the engaging arrangement may include one or more grooves and one or more protrusions. For instance, a groove may be defined by the lens barrel or the lens carrier, and a protrusion may extend from the lens barrel or the lens carrier to at least partially into the groove. In some cases, the engaging arrangement may include an adhesive positioned continuously 360 degrees around the engaging arrangement between the lens barrel and the lens carrier.

Flangeless optical assembly for receiving glue dispense

An apparatus and method of producing a dual overmolded camera module. The dual overmolded camera module including a dual overmolded image sensor module having a first image sensor device and a second image sensor device spaced from one another in an x-direction at a predetermined alignment distance, and wherein at least one of the first image sensor device and the second image sensor device have a conductive via formed therethrough and a redistribution layer along at least one side. The dual overmolded camera module further including a first lens assembly and a second lens assembly mounted over respective ones of the first image sensor device and the second image sensor device, and wherein both the first lens assembly and the second lens assembly are aligned with a common target.

Dual overmolded reconstructed camera module

A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

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Cupertino, CA, United States of America

Julien C Vittu