General Electric Company

Julie Y Fichot

Alfred Roesch

A thermal matching element which exhibits high electrical conductivity and high thermal conductivity is used to join a heat generating semiconductor device with a heat transmissive electrically conductive members. The thermal matching element is independently selected for different directions in the plane of the matching surface.

Thermal stress relieving bimetallic plate

A semiconductor device having especially low thermal impedance between a semiconductor element and a heatsink is described wherein the semiconductor element is directly disposed upon a thin, low thermal impedance current-spreading layer on an electrically isolated layer. An electrode connected to the current-spreading layer surrounds the semiconductor element so that it introduces no additional thermal impedance between the semiconductor element and the heatsink. Relatively inexpensive electrode materials may be used in accordance with the invention without increasing thermal impedance.

Low thermal resistance, low stress semiconductor package

A semiconductor device is described wherein a semiconductor pellet is disposed within a hermetically sealed chamber including a thermally conductive base and a substantially rigid housing, said housing including an open upper chamber in which are disposed electrical terminals and which is filled with a sealing and strengthening layer to substantially increase the strength and hermeticity of the package.

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Skaneateles, NY, United States of America

Julie Y Fichot