Lecroy Corporation

Tektronix, Inc.

Teledyne Lecroy, Inc.

Julie A Campbell

Lawrence W Jacobs

Stephen Mark Sekel

Ira G Pollock

William A Hagerup

Josiah A Bartlett

Daniel G Knierim

Stanley Joseph Sula

Christina D Enns

David T Engquist

Karl A Rinder

James E Spinar

Daniel J Ayres

David A Sailor

Jason Victor Tsai

Bruce Clinton Tollbom

Albert Sutono

Christina Colby Barsotti

Jay Schwichtenberg

Kathleen F M Ullom

Regina R Mrozik

Charles M Hartmann

Barton T Hickman

Joshua J O'Brien

Sam J Strickling

Charles W Case

Raymond A Zandonatti

Yigal Shaul

Monty Smith

Lenny Rayzman

Matthew J Hull

Christina Enns

Regina Mrozik

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a test-and-measurement probe within an interior cavity of the shroud, while permitting a second portion of the test-and-measurement probe head to extend out of the shroud into a testing environment. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. A fluid inlet conduit enters the shroud through an access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce a heat-transfer fluid to a probe-head portion of the test-and-measurement probe.

Thermal management system for a test-and-measurement probe

A method of securing a probe tip to a device under test (DUT), the method comprising: positioning the probe tip near a test point of the DUT, the probe tip comprising a connection point on a signal-path portion of the probe tip and an attachment tab, the connection point making an electrical connection with the test point of the DUT, the attachment tab extending away from the signal-path portion of the probe tip; applying an adhesive to the DUT through a hole in the attachment tab of the probe tip; and curing the adhesive to secure the probe tip to the DUT.

Securing a probe to a device under test

A new test system includes a programmed device having an input port for receiving a signal for testing or measuring on the programmed device, and a reprogrammable test accessory having an output coupled to the input port of the programmed device. The reprogrammable test accessory further includes a test port structured to accept one or more test signals from a Device Under Test (DUT), and a reprogrammable processor. The reprogrammable processor may further include reprogrammable standards and protocols, reprogrammable triggers and margin detection, reprogrammable link training, reprogrammable handshaking, and reprogrammable setup and control facilities for either or both of the DUT and the programmed device.

Test and measurement instrument accessory with reconfigurable processing component

An apparatus has at least substrate having at least two conductive paths, a least two connectors positioned in a first plane, and a movable stage connected to one of the at least one substrate to move the one substrate perpendicular to the first plane form an electrically conductive path between two of the at least two connectors.

Precision, high bandwidth, switching attenuator

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.

Encapsulated component attachment technique using a UV-cure conductive adhesive

A test-probe tip having a tip component, a resistive element, and a compliance member. The tip component is configured to electrically connect to a device under test at a first end of the tip component. The resistive element is electrically connected to a second end of the tip component along a signal-flow axis. The resistive element is configured to provide electrical impedance to an electrical signal passing through the resistive element. The compliance member is configured to allow movement of the tip component in a first direction when a mechanical force applied to the tip component in the first direction and to cause movement of the tip component in an opposite, second direction when the mechanical force applied to the tip component is removed or reduced. Architectures for the resistive element are also described.

Resistive test-probe tips

Test and measurement probes include a body, an adjustable member moveably coupled to the body and having a changeable position relative to the body, and a transducer subsystem structured to measure the position of the adjustable member and configured to output a position signal indicative of the position of the adjustable member. A change in the position of the adjustable member causes a change in an electrical characteristic of the probe. A position-dependent correction factor may be used to correct the change in the electrical characteristic. Methods of compensating for a change in a response of a test and measurement system include monitoring a position sensor output to detect a position change of a first part of a probe relative to a second part, determining that the position sensor output value has crossed a boundary value between a first and second range, and applying a compensation factor corresponding to the second range to modify the response of the system.

Position sensing in a probe to modify transfer characteristics in a system

A method for electrically connecting a test and measurement instrument to a via of a printed circuit board, PCB, the method comprising: dispensing a UV-curable conductive adhesive into a back-drilled hole formed in the PCB, the back-drilled hole extending to the via, such that the dispensed adhesive contacts the via; curing the dispensed adhesive by applying a UV light source to the dispensed adhesive; and connecting a test and measurement instrument to the cured adhesive using a conductive member.

Back-drilled via attachment technique using a UV-cure conductive adhesive

An apparatus for coupling a test and measurement instrument to a device under test comprises a clip structured to be attached between two conductive portions of the device under test, and an insert structured to be removably installed in the clip. The insert is configured to provide a current path between the two conductive portions of the device under test. In embodiments, the insert comprises a resistive element, which may be a round rod resistor. Additional embodiments may be described and/or claimed herein.

Surface-mountable apparatus for coupling a test and measurement instrument to a device under test

A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.

Component attachment technique using a UV-cure conductive adhesive

A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.

Probe tip and probe assembly

A probe for making electrical contact with a device-under-test test point includes a body, a rigid member capable of travelling linearly with respect to the body, a flexible arm having a test point contact at one end and fastened to the rigid member at the other end, and a flexible linkage fixed to the body and to the flexible arm. The flexible linkage is structured to cause the flexible arm to bend in response to travel of the rigid member in one direction, and to cause the flexible arm to unbend in response to travel of the rigid member in the other direction. A second flexible arm may be included, the two arms opening and closing to change the distance between test point contacts. A light source may be disposed on a portion of the flexible linkage that simultaneously articulates to automatically track the orientation of the test point contact.

Test and measurement probe with adjustable test point contact

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element coupled with the plunger component at one end and with the tip component at the opposite end, the resistive/impedance element including at least one rod having a semi-cylindrical form and a resistive material situated thereon.

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Beaverton, OR, United States of America

Julie A Campbell