Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Julia Woertink

Yi Qin

Zuhra I Niazimbetova

Mark Lefebvre

Erik Reddington

Matthew A Thorseth

Joanna Dziewiszek

Julia Kozhukh

Wan Zhang-Beglinger

Margit Clauss

Adolphe Foyet

Jonathan D Prange

Pedro O Lopez Montesinos

Niazimbetova Zuhra

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of &#x3b1;-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Electroplating baths of silver and tin alloys

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Midland, MI, United States of America

Julia Woertink