Microsoft Technology Licensing, LLC

Julia Purtell

Michael Lau

Brian K Langendorf

Amit P Marathe

Kingsuk Maitra

Jeffrey Mark Reents

Tung Thanh Nguyen

Ranjit Gannamani

Rune Hartung Jensen

The present disclosure relates to a device for reading from and/or writing to a removable storage card. The device can comprise a housing including a wall defining a housing opening sized to receive a removable storage card. The device can also comprise a thermal management system attached to at least a part of the wall of the housing. Additionally, the device can comprise a biasing mechanism interoperable with the housing and configured to bias a card surface of the removable storage card into thermal communication with the thermal management system in response to insertion of the removable storage card into the housing opening. In some aspects, the biasing mechanism includes one or more elastic members configured to apply a biasing force to the removable storage card in response to the insertion of the removable storage card into the housing opening.

High performance removable storage devices

Examples are disclosed that relate to cooling multiple heat-generating components in an electronic device. One example provides a cooling module including an airflow channel downstream of a blower to receive a flow of air generated by the blower, a heat sink extending into the airflow channel and configured to direct air toward a first outlet, and an air-diverting structure positioned within a gap between a distal surface of the heat sink and an opposing interior surface of the airflow channel, the air-diverting structure configured to redirect air flowing in the gap toward a second outlet.

Split airflow cooling module

Embodiments are disclosed that relate to implementing semiconductor device cooling systems that leverage awareness of regional voltage and temperature reliability risk considerations. For example, one disclosed embodiment provides a method of implementing a cooling system configured to cool an integrated circuit. The method involves first determining a heat dissipation factor that would reduce each region of the integrated circuit to a reduced temperature in order to maintain an overall failure rate. An analysis is then performed, using an insight about the relative reliability risk of elevated voltage and temperatures, to identify a region of the integrated circuit whose temperature can be permitted to rise without exceeding the overall failure rate, thereby permitting implementation of a cooling system with a reduced heat dissipation factor.

Reliability aware thermal design

Growing community of inventors

Menlo Park, CA, United States of America

Julia Purtell