At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Julia Platzer

Bernhard Reitmaier

Ferdinand Lutschounig

Sabine Liebfahrt

Markus Frewein

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Component carrier and method of manufacturing the same

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

Growing community of inventors

Graz, Austria

Julia Platzer