3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Julia P Williams

David A Kaisaki

Heather K Kranz

Craig F Lamphere

Chong Yong Kim

Thomas P Klun

Scott R Culler

Carl R Kessel

Wesley J Bruxvoort

Richard J Webb

Kwok-Lun Ho

Robert P Messner

The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing of a glass workpiece comprising a backing and at least one polishing layer. The polishing layer comprises cerium oxide particles dispersed within a binder. The binder provides the attachment means of the at least one polishing layer to the backing. The abrasive article is capable of reducing an initial Rtm of about 0.8 .mu.m or greater on a glass test blank to a final Rtm of about 0.3 .mu.m or less in about one minute using an RPE procedure defined herein. The present invention is also directed to a method of polishing a glass workpiece using the present abrasive article.

Method and article for the production of optical quality surfaces on

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

Method of modifying an exposed surface of a semiconductor wafer

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Saint Paul, MN, United States of America

Julia P Williams