Schott Ag

Julia Gold

Sabine Pichler-Wilhelm

Martin Letz

Martun Hovhannisyan

Linda Johanna Bartelt

Antonio Trizzino

Dang Cuong Phan

Matthias Rindt

Susanne Schmid

Thomas Beerhorst

The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Glass and melt solder for the passivation of semiconductor components

A porous sintered body with an electrically conductive coating is provided. The sintered body has an open porosity in a range from 10 to 90%. The electrically conductive coating is bonded to the surface of the pores and is part of a heating device in a vaporizer. The electrically conductive coating lines the pores located in the interior of the sintered body so that when the sintered body is electrically connected and a current is applied, the current flows at least partially through the interior of the sintered body so that the interior of the sintered body is heated. A method for producing a porous sintered body with an electrically conductive coating is also provided.

Sintered body with electrically conductive coating

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Buchbach, Germany

Julia Gold