Taiwan Semiconductor Manufacturing Comp. Ltd.

Jui-Wen Su

Shi-Hua Tzeng

In order to reduce the incidence of stress concentration areas in an etched opening, a thinner polyimide layer is deposited to minimize gap formation therein, and a descum process is then performed to increase the angle of the presented layer surface. Reduction of the stress in this manner reduces the incidence of cracking of the later formed metal contact, which improves the overall pass rates of semiconductor devices so manufactured.

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Hsinchu, Taiwan

Jui-Wen Su