Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Jui-Wen Hung

Ching-Bai Hwang

Jie Zhang

Nien-Tien Cheng

Ping-Yang Chuang

Wei-Jen Huang

Yi-Chang Liu

Shang-Chih Liang

Jian-Zhong Lu

Shih-Yao Li

Chih-Hao Yang

Ben-Fan Xia

Jin-Gong Meng

Cheng-Jen Liang

Jie-Bo Peng

An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Base with heat absorber and heat dissipating module having the base

An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Electronic deviec having heat dissipation device

An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

Electronic device having fixing member

An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Electronic device having heat dissipation device

An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.

LED lamp

A lamp includes a heat sink and a lamp cover mounted on the heat sink. The lamp cover includes a connecting portion. The heat sink includes a plurality of clamping portions. The plurality of clamping portions surrounds the lamp cover and is spaced apart from each other along a circumferential direction. The plurality of clamping portions each defines a recess facing the lamp cover. The recesses communicate with each other along the circumferential direction whereby an annular engaging groove is defined in the heat sink by the recesses. The connecting portion is engaged in the engaging groove whereby the lamp cover is connected with the heat sink.

Lamp with heat sink and lamp cover mounted on the heat sink

A thermal module assembly includes a first thermal module () and a second thermal module (). The first thermal module () has a fan () with an air outlet, a first heat sink () positioned at the air outlet and a first clamp portion () formed on the first heat sink (). The second thermal module () has a second heat sink () and a second clamp portion () formed on the second heat sink (). The second heat sink () is juxtaposed with the first heat sink (). The first heat sink () and the second heat sink () are combined together via engagement of the first clamp portion () and the second clamp portion () so that airflow produced by the fan () flows past the first heat sink () and the second heat sink () in order.

Thermal module assembly and heat sink assembly having at least two engageable heat sinks

An LED lamp includes a heat sink, a reflecting cup, a heat pipe and an LED. The heat sink includes fins cooperatively defining a receiving space therein. Each of the fins includes a plate-shaped main body and a flange extending rearward from a periphery side of the main body. The flanges are connected to each other to cooperatively form an annular supporting surface. The reflecting cup is received in the receiving space of the heat sink. The heat pipe includes an evaporating section located above the reflecting cup and a condensing section thermally connecting with the annular supporting surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface facing downwardly towards the reflecting cup.

A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.

Heat dissipation module and electronic device having the same

A centrifugal blower () includes a casing () and a rotor () rotatable disposed in the casing. The casing includes a base plate (), a sidewall () extending from the base plate and a cover () covering the sidewall. The sidewall is a multilayer structure and includes a first section () and a second section (). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board () and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.

Centrifugal blower

A thermal module includes a centrifugal blower (), a heat sink () mounted to an air outlet () of the centrifugal blower, a heat pipe () connecting the heat sink with a heat generating electronic component, and a resilient clip () for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion () disposed above an evaporation section () of the heat pipe, a plate portion () disposed at one end of the pressing portion for being fixed to a sidewall (), and an abutting portion () disposed at the other end of the pressing portion and including an abutting plate () for abutting against a bottom surface of another sidewall ().

Thermal module

A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.

Heat dissipation device and computer using same

An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.

Portable electronic device incorporating extendable thermal module

A portable electronic device includes a housing receiving a heat generating electrical component therein, a display unit and a heat dissipating hinge pivotably interconnecting the housing and the display unit. The heat dissipating hinge includes a body, a cover, a first heat pipe and a second heat pipe. A body defines a first receiving groove receiving a condenser section of the second heat pipe therein. The cover and the body cooperatively define a receiving channel receiving the evaporator section of the first heat pipe therein. Heat generated by the electric device is transferred from the heat generating electronic component to the display unit through the heat dissipating hinge. First and second supporting members are secured to two ends of the evaporator section of the first heat pipe to prevent leakage of thermal grease from a middle portion of the receiving channel.

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Taipei Hsien, Taiwan

Jui-Wen Hung