United Microelectronics Corp.

Compal Electronics, Inc.

United Electronics Corp.

Jui-Tsen Huang

Kun-Hsuan Chang

Yu-Hao Tseng

Ting-Wei Wu

Wei-Jun Wang

Jiunn-Ren Hwang

Wen-Yi Chiu

Hsin-Chieh Cheng

Chia-Min Liao

Tse-Hsun Pang

Chang-Jyh Hsieh

Kuei-Chun Hung

Ming-Che Weng

Chih-Chien Liu

Chan-Lon Yang

Tri-Rung Yew

Ming-Sheng Yang

Shi-Kuan Chen

Po-Hsien Yang

Tsu-An Lin

Yi-Fang Cheng

Chien-Hua Tsai

Pei-Yuan Lo

Ling Lu

Michael Wei-Che Huang

Kuang-Hua Shih

A picture selection method of projection touch for a projection touch system is provided. The projection touch system includes an image projection module, a sensing module, an image recognition module including at least one camera module and a processing unit. The picture selection method includes: the sensing module sensing and transferring a first projection coordinate on the target picture at a first time point of a sensing action; the sensing module sensing and transferring a second projection coordinate on the target picture at a second time point of the sensing action; the processing unit selecting at least one to-be-selected picture in the target picture based on the first and second projection coordinates and generating a set of selected image data; and the processing unit controlling the selected image data projected by the image projection module to move to a designated position according to a movement instruction of the user.

Picture selection method of projection touch

A smart lighting device includes an illumination module, an image projection module and a projection mode switching module. The image projection module is pivoted to the illumination module and has a plurality of operation modes. The image projection module rotates relative to the illumination module and is switched among a standby mode and the operation modes. The projection mode switching module is configured to sense a rotation angle of the image projection module with respect to the illumination module. A brightness value of the illumination module and an image frame of the image projection module are adjusted according to the rotation angle.

Smart lighting device and operation mode transforming method of a smart lighting device for switching between a first operation mode and second operation mode

A smart lighting device includes an illumination module, an image projection module, a camera module, a sensing module and an identifying module. The illumination module is configured to provide illumination light beams. The image projection module is configured to project an image frame. The sensing module has a specific sensing area and is configured to sense an operation action of a user within the sensing area. The identifying module is electrically connected to the image projection module, the camera module and the sensing module. The camera module is configured to shoot a content to be identified to form an image to be identified. The identifying module is configured to identify the image to be identified. The image projection module is configured to display information acquired by the identifying module in the projected image frame. A control method for the smart lighting device is also provided.

Smart lighting device and control method thereof

A smart lighting device includes a light source module, an image projection module and an ambient light sensing module. The image projection module is pivoted to the light source module, and the ambient light sensing module is electrically connected to the light source module and the image projection module. The ambient light sensing module is configured to sense a brightness value of ambient light. Brightness values of the light source module and the image projection module are adjusted according to the brightness value of the ambient light sensed by the ambient light sensing module. A control method for a smart lighting device is also provided.

A projection device includes a projection module and a first camera module. The projection device has a first optical axis and configured to form a projection area, wherein a projection of the first optical axis on an X-Z plane of the projection device is perpendicular to an X-Y plane on which the projection area is formed. The first camera module is disposed on a side of the projection module and includes a second optical axis, wherein the first camera module is configured to form a first shooting area, the second optical axis forms a first angle &#x394;&#x3b8;with respect to the first optical axis, the projection area at least partially overlaps the first shooting area to form an overlapping area, and the first angle &#x394;&#x3b8;is a function of a distance between the projection module and the first camera module.

Projection device with camera module

A projection apparatus includes an image projection module, a lens module and a light emitting module. The image projection module has a first optical axis and forms a projection area on a bearing surface. A projection of the first optical axis on an X-Z plane is perpendicular to an X-Y plane on which the projection area is formed. The lens module comprises N cameras, each having a corresponding second optical axis and being for forming a shooting area. The N second axes are tilted to the first optical axis and have an angle with respect to the X-Z plane. The light emitting module includes M light emitting components, each having a corresponding third optical axis and being for forming a sensing area. The projection area, the N shooting areas and the M sensing areas are at least partially overlapped with each other to form a rectangular shooting sensing area.

Projection apparatus

A keyboard input method and an assistant system thereof are provided. In the present method, first, an assistant on-screen keyboard program is launched and an input signal is received. Then, if it is determined that the input signal represents an input character, whether the input character leads to an input error is determined according to an input method of an electronic device. If the input character leads to the input error, a keyboard position of the key corresponding to the input character is obtained, and a partial area of an assistant on-screen keyboard is displayed according to the position, wherein the partial area includes the key corresponding to the input character.

Keyboard input method and assistant system thereof

A composite photoresist structure includes a first organic layer disposed over a substrate to be etched, a sacrificial layer disposed on the first organic layer, and a second organic layer disposed on the sacrificial layer. The thickness of the first organic layer and the thickness of the second organic layer are both larger than the thickness of the sacrificial layer.

Composite photoresist structure

A method of relieving wafer stress is provided. A wafer is provided, wherein at least a dielectric layer has already formed over the wafer and the wafer has a first and a second area. At least no circuits are formed on the dielectric layer within the first area. Thereafter, openings are formed in the dielectric layer within the first area. A material layer is formed over the dielectric layer. Thus, pits are formed on the surface of the material layer at locations above the openings. Through the pits on the material layer, stress within the material layer is relieved and hence the amount of stress conferred to the wafer is reduced.

Method of relieving wafer stress

A method of fabricating a semiconductor device. A first organic layer, a silicon-containing sacrificial layer, and a second organic layer are sequentially formed on a substrate. A photolithography process is performed for forming a predetermined pattern in the second organic layer. Thereafter, the second organic layer is utilized as an etching mask for etching the silicon-containing sacrificial layer till a surface of the first organic layer is exposed, thus transferring the predetermined pattern to the silicon-containing sacrificial layer. The silicon-containing sacrificial layer is utilized as an etching mask for etching the first organic layer till a surface of the substrate is exposed, thereby transferring the predetermined pattern to the first organic layer. Then, the silicon-containing sacrificial layer and the first organic layer are utilized as an etching mask for etching the substrate, thereby transferring the predetermined pattern to the substrate. Finally, the first organic layer is removed from the substrate.

Method of fabricating a semiconductor device

An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.

Optical proximity correction method

A method of fabricating a semiconductor device. A first organic layer, a sacrificial layer, and a second organic layer are sequentially formed on a substrate. Then, a photolithography process is performed for forming a predetermined pattern in the second organic layer. Thereafter, the second organic layer is utilized as an etching mask for etching the sacrificial layer till a surface of the first organic layer is exposed, thus transferring the predetermined pattern to the sacrificial layer. Subsequently, the sacrificial layer is utilized as an etching mask for etching the first organic layer till a surface of the substrate is exposed, thereby transferring the predetermined pattern to the first organic layer. Then, the sacrificial layer and the first organic layer are utilized as an etching mask for etching the substrate, thereby transferring the predetermined pattern to the substrate. Finally, the first organic layer is removed by use of plasma.

A composite photoresist structure includes an first organic layer located on a substrate, a sacrificial layer located on the first organic layer, and a second organic layer located on the sacrificial layer. The first organic layer is made of materials that can be easily removed by plasma. Therefore, the surface of the substrate will not be damaged while transferring a predetermined pattern onto the substrate.

Composite photoresist for pattern transferring

A method for forming a plane structure. It comprises the following steps: forms a liquid material with a thicker thickness on a substrate, rotating both the liquid material and the substrate around the axis of the substrate, applying a solvent on the rotating liquid material to remove partial liquid material. It also comprises the following steps: form a thicker removable material on a substrate, and partially remove the surface part of the removable material.

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Taipei, Taiwan

Jui-Tsen Huang