Macronix International Co., Ltd.

Jui-Neng Tu

June-Min Yao

In a dual damascene process for forming a multi-layer low-k dielectric interconnect, the formation of each layer of interconnect comprises deposition of a first low-k dielectric layer, etching of the first low-k dielectric layer to form two dual damascene vias, formation of two Cu conductor plugs enclosed with barrier layers in the two dual damascene vias, etching of the first low-k dielectric layer between the two dual damascene vias to form a trench, and spin-on of a second low-k dielectric layer filled in the trench. The spin-on low-k dielectric layer is selected to have a dielectric constant smaller than that of the first low-k dielectric layer to reduce the equivalent dielectric constant in the layer of interconnect.

Dual damascene process for forming a multi-layer low-k dielectric interconnect

A re-oxidation process of a semiconductor device is described. A substrate having a stacked structure thereon is provided, wherein the stacked structure includes a polysilicon/tungsten silicide interface. A thin CVD oxide layer is formed on the substrate and the stacked structure with a chemical vapor deposition (CVD) process. Then, an oxidation process is performed to form a thermal oxide layer on the substrate and the stacked structure.

Growing community of inventors

Hsinchu, Taiwan

Jui-Neng Tu