Intel Corporation

Amkor Technology, Inc.

Jui Min Lim

Eric C Palmer

Todd B Myers

Nicholas Randolph Watts

Renee M Defeo

Jeffrey Alan Miks

Nicolas R Watts

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Passive within via

Method of embedding passive component within via

A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the planer member. The support members are attached to the first surface of the substrate to form a cavity over the die with the planer member positioned above the die. An encapsulant is provided for encapsulating the device, wherein an exterior surface of the planer member is exposed. A non-tapered opening is formed in the planer member. The encapsulant is injected through the opening to encapsulate the cavity and the encapsulant will partially fill the non-tapered opening.

Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate

A method for forming an plurality of paths on a substrate includes drilling an opening for a via to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Via including multiple electrical paths

A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Growing community of inventors

Chandler, AZ, United States of America

Jui Min Lim