Vanguard International Semiconductor Corporation

Jui-Lung Chen

Chia-Chiuan Chang

Yi-Hsun Chung

Wei-Ting Chen

Wei-Shung Chen

Tien-Hui Huang

Ho-Hsiang Chen

Chieh-Yao Chuang

Gia-Hua Hsieh

Hsuan-Chi Su

Yu-Hsi Ke

Yu-Wen Chen

Yu-Chih Yeh

Ching-Hsiang Lin

A low dropout regulator is provided. The low dropout regulator includes an output-stage circuit, a reference-voltage generation circuit, a timing controller, and an active low dropout circuit. When the low dropout regulator is at an operation mode, the output-stage circuit is controlled by a first enable signal to generate first output voltage to an output node of the low dropout regulator. The reference-voltage generation circuit is controlled by a bias voltage to generate a first reference voltage. The timing controller is coupled to the output node and receives the first reference voltage. When the low dropout regulator is in the operation mode, the timing controller programs the first enable signal according to the reference voltage and the voltage at the output node. When the low dropout regulator is in a standby mode, the active low dropout circuit generates a second output voltage to the output node.

Low dropout regulators with fast response speed for mode switching

An anti-fuse memory cell is provided. The anti-fuse memory cell includes a programmable transistor and a selection transistor. The programmable transistor includes a gate structure, a first doped region and a lightly doped region. The first doped region is divided into a first portion doped region, a second portion doped region and a third portion doped region. The first and second portion doped regions are respectively a source and a drain of the programmable transistor, and the third portion doped region is disposed between the first and second portion doped regions. The lightly doped region is distributed around a channel region of the programmable transistor, and adjacent to the first, second and third portion doped regions. The selection transistor includes a gate structure and a second doped region, and connected in series to the programmable transistor through the first portion doped region.

Anti-fuse one-time programmable memory cell and anti-fuse one-time programmable memory array

A memory device is provided. The memory device includes a memory device, a plurality of word lines and bit lines, first and second decoders, and a control circuit. The memory array includes memory cells on rows and columns. Each word line is coupled to the memory cells in one row. Each bit line is coupled to the memory cells in one column. The first decoder selects one word line according to an address signal and a first control signal. The control circuit respectively generates the first control signal and the second control signal according to a first clock signal and a second clock signal. In the period during which the first decoder selects the one word line, the second decoder selects at least two bit lines according to the address signal and a second control signal. The memory device performs a read/write operation on the selected bit lines.

Memory devices and control methods thereof

This invention provides a poly fuse burning system comprising a poly fuse, a controllable power source supplying power for burning the poly fuse, and a monitor circuit monitoring the burning state of the poly fuse, wherein when a targeted burning state is reached, a control signal is output to shut down the controllable power source to stop the burning.

Poly fuse burning system

A storage device including a memory and a reading circuit is disclosed. The memory includes a plurality of word lines, a first bit line, a second bit line, a third bit line, and a plurality of cells. The word lines are sequentially disposed in parallel. The first, the second, and the third bit lines are sequentially disposed in parallel and vertical with the word lines. Each cell corresponds to one word line and one bit line. The word line, which corresponds to the cell corresponding to the first bit line, differs from the word line, which corresponds to the cell corresponding to the second bit line. The read circuit is coupled to the memory for reading the data stored in the memory.

Memory and storage device utilizing the same

A burn-in method for SRAMs and chips. For a memory cell of the SRAM, the SRAM burn-in method controls the control signals of the memory cell to generate current paths to pass through the memory cell, the corresponding bit-line and the corresponding bit-line-bar. The contacts/vias in the current paths are tested by providing burn-in currents to flow through the current paths, so that mismatched contacts/vias are burned by the burn-in currents. SRAMs that fail the burn-in test are abandoned after the burn-in procedure.

Burn-in methods for static random access memories and chips

A static random access memory comprising a column driver, a row driver, a cell, and a control unit is disclosed. The column driver selects a first word line or a second word line. The row provides data to a first bit line and a second bit line. The data of the first bit line is opposite to that of the second bit line. The control unit controls the voltage of the cell. In normal mode, the voltage of the cell is equal to a second voltage. In stand-by mode, the voltage of the cell exceeds the second voltage.

Static random access memory

A memory system is provided, comprising at least one memory unit and a source power supply circuit. Each memory unit is coupled between a source voltage and a ground voltage and accesses digital data according to a word line signal and a bit line signal. The source power supply circuit provides the source voltage to the memory units. When the memory unit is in a writing status, the source voltage is the first power voltage. When the memory unit is in a reading status, the source voltage is the second power voltage. The second power voltage equals to the first power voltage subtracted by a specific voltage for avoiding rewriting error.

Growing community of inventors

Hsinchu, Taiwan

Jui-Lung Chen