Cabot Microelectronics Corporation

Jui-Kun Lee

Chris Chang Yu

Ronald E Myers

David G Mikolas

The invention provides a method of polishing a substrate comprising a lanthanide-containing metal oxide material. The method comprises the steps of (i) providing a polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an acid, and (c) a liquid carrier, (ii) providing a substrate comprising a metal oxide layer, wherein the metal oxide layer comprises at least one lanthanide series element, and (iii) abrading at least a portion of the metal oxide layer with the polishing system to polish the substrate. The lanthanide-containing metal oxide material can be a lanthanide oxide, a doped lanthanide oxide, a lanthanide-doped metal oxide, a lanthanide perovskite, or any other suitable lanthanide-containing mixed metal oxide material, in particular those used as solid electrode and solid electrolyte materials in gas sensor and fuel cell devices.

Method of polishing a lanthanide substrate

Methods for manufacturing substrates with difficult to polish features using reverse mask etching and chemical mechanical planarization techniques.

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Hoffman Estates, IL, United States of America

Jui-Kun Lee