Bizlink International Corporation

Industrial Technology Research Institute

Jui-Hung Chien

Hsin-Tuan Hsiao

Chiao-Ling Lung

Ding-Ming Kwai

Yung-Fa Chou

Shi-Jung Chen

Yen-Chun Chen

A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, insulating through holes, a signal transmission layer and a polymer conductive member. The ground layer is disposed between the insulating layer and the insulating substrate layer. The signal transmission layer is disposed on one side of the insulating layer opposite to the ground layer. The insulating through holes penetrate through the signal transmission layer and the insulation layer to connect to the ground layer. The polymer conductive member is disposed within the insulating through holes, and one part thereof is electrically connected to the ground layer, and another part thereof extends outwards from the signal transmission layer.

Circuit board with polymer conductive members

A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.

Cable end connector

A connector assembly includes a wire end connector for electrically connecting to a board end connector. The wire end connector includes a main body portion and an insertion portion. The insertion portion is connected to the main body portion, and the insertion portion is configured to couple to the board end connector. The main body portion is provided with a plurality of elastic claws extending outward from the main body portion to press on the board end connector when the insertion portion is coupled to the board end connector so as to stably connect the wire end connector to the board end connector.

Connector assembly

A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.

Connector with high heat dissipation efficiency

Connector with heat sink

An electronic connector has a first shell, a second shell, a space, and at least one fixing unit. The first shell has a cover segment and at least one first assembling segment mounted securely on the cover segment. The second shell has at least one second assembling segment arranged with the first assembling segment of the first shell along the width direction of the electronic connector. The space is formed between the cover segment of the first shell and the second shell. The first assembling segment of the first shell is located in the space. The fixing unit is mounted through the first assembling segment of the first shell and the second assembling segment of the second shell along the width direction. Therefore, wires will not be restricted by the first assembling segment and the second assembling segment in the width direction.

Electronic connector

A high speed wire end connector includes a printed circuit board, a cable, an inner film, an outer casing, and a molded bonding layer. The cable is soldered to the printed circuit board, the inner film covers a part of the cable and a part of the printed circuit board, and the outer casing is used to fix the printed circuit board, the cable and the printed circuit board, and a part of the printed circuit board is passed through a guide hole of the outer casing. The molded bonding layer bonds the outer casing to the inner film. In addition, a metal spring latch is mounted on the outer casing.

High speed wire end connector

A high speed wire end connector manufacturing method includes the following steps. First, a cable is soldered to a printed circuit board, and then an inner film is formed to cover a portion of the cable and a portion of the printed circuit board by an insert molding process. Another portion of the printed circuit board is passed through a guide hole of an outer casing, and a molded bonding layer is formed by an outer molding process to bond to the outer casing and the inner film. In addition, a metal spring latch is fixed on the outer casing. In addition, a high speed wire end connector is also disclosed herein.

High speed wire end connector and manufacturing method thereof

A semiconductor device stacked structure is disclosed, which includes multiple semiconductor devices and at least one reinforcing structure. The semiconductor devices are stacked on one another. At least one semiconductor device has at least one through silicon via. Each reinforcing structure surrounds a corresponding one of the at least one through silicon via and is electrically insulated from the semiconductor devices. The at least one reinforcing structure includes multiple reinforcing elements and at least one connecting element. Each reinforcing element is disposed between the semiconductor devices. Vertical projections of the reinforcing elements on a plane define a close region, and a projection of the at least one through silicon via on the plane is located within the close region. The connecting element is located in an overlapping region of the vertical projections of the reinforcing elements on the plane, for connecting the reinforcing elements to form the reinforcing structure.

Semiconductor device stacked structure

A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress relief body has an upper surface and a lower surface opposite to each other. The first stress relief base is disposed on the upper surface of the stress relief body. The second stress relief base is disposed on the lower surface of the stress relief body. The at least one first stress relief base and the at least one second stress relief base are interlaced to each other.

Growing community of inventors

Taipei, Taiwan

Jui-Hung Chien