Omnivision Technologies, Inc.

Visera Technologies Company Limited

Auo Corporation

Jui-Hung Chang

Teng-Sheng Chen

Tzu-Wei Huang

Chia-Hui Huang

Ming-Kai Liu

Chih-Lung Lin

Wei-Ping Chen

Ming-Yang Deng

Ming-Hung Chuang

Yi-Chien Chen

A driving circuit includes a driving transistor, first to second capacitors and first to third switching transistors. The driving transistor is configured to control a driving current provided to a light emitting element to emit light. The first capacitor includes a first terminal coupled to a gate terminal of the driving transistor. The first switching transistor coupled between a second terminal of the first capacitor and a driving voltage terminal. The second switching transistor includes a first terminal coupled to a gate terminal of the first switching transistor and a second terminal coupled to a first reference voltage terminal. The third switching transistor coupled between a gate terminal of the second switching transistor and a second reference voltage terminal. The second capacitor includes a first terminal coupled to a gate terminal of the third switching transistor and a second configured to receive a sweep signal.

Driving circuit

A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Image sensor devices and methods for manufacturing the same

Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.

Camera module and method for fabricating the same

Growing community of inventors

Hsinchu, Taiwan

Jui-Hung Chang