Altek Semiconductor Corp.

Jui-Hsin Chang

Yung-Neng Yu

An image capturing device includes a frame structure, a first image capturing unit, at least one second image capturing unit, and an infrared emitting unit, wherein the first image capturing unit, the second image capturing unit, and the infrared emitting unit are respectively disposed on the frame structure. The first image capturing unit and the infrared emitting unit form a structured light depth camera module, and the first image capturing unit and the second image capturing unit form a stereo light depth camera module.

Image capturing device

A portable electronic device including a main body, a camera module and a movement mechanism is provided. The main body has an accommodating groove located in the main body and exposed at a surface thereof. The camera module is disposed in the accommodating groove, and the camera module has a wide angle lens. The movement mechanism is located between the camera module and the accommodating groove, and the camera module is configured to move between a first position and a second position in the accommodating groove. When the camera module is located at the first position, an upper surface of the wide angle lens is lower than or equal to the surface of the main body. When the camera module is located at the second position, the wide angel lens is protruded out of the surface of the main body.

Portable electronic device having mechanism to move embedded camera module to different positions

An image pickup module includes a cover, a plurality of image pickup units, a self-curing gel, and a photopolymer gel. The cover includes an upper shield, a side shield, and illumination openings and image pickup openings on the upper shield, and the upper shield and the side shield surround an accommodation space where the image pickup units are disposed. The cover at least covers a portion of upper surfaces of the image pickup units. The photopolymer gel is disposed on positions corresponding to the illumination openings that expose the photopolymer gel. The self-curing gel is disposed between the upper surfaces of the image pickup units and the upper shield. The photopolymer gel is configured to fix relative positions between the image pickup units and the cover. A manufacturing method of an image pickup module is also provided.

Growing community of inventors

Hsinchu, Taiwan

Jui-Hsin Chang