Advanced Chip Engineering Technology, Inc.

Epistar Corporation

Adavanced Chip Engineering Technology Inc.

Jui-Hsien Chang

Wen-Kun Yang

Min-Hsun Hsieh

Been-Yu Liaw

Cheng-Nan Han

Wen-Bin Sun

Chin-Chen Yang

Tung-Chuan Wang

Kuang-Chi Chao

His-Ying Yuan

Chihwei Lin

Cheng-hsien Chiu

Hung-Hsuan Chen

Chih-Peng Ni

Tsen-Kuei Wang

Diann-Fang Lin

Chao-Nan Chou

Hsien-Wen Hsu

Hsin-Yu Lee

Chun Hui Yu

Chen-Yen Fan

Wen-Ping Yang

The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.

Light-emitting device and the method of manufacturing the same

This disclosure discloses a light-emitting device. The light-emitting device has a first outermost sidewall and includes a light-emitting diode and an electrode. The light-emitting diode has a pad and a side surface. The electrode has a segment formed on the pad to extend beyond the side surface, and a first protrusion extending from the segment to the first outermost sidewall.

Light-emitting device with metallized mounting support structure

An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.

Image sensor package and forming method of the same

The present invention provides an image sensor module. The image sensor module has a die formed on a substrate, the die having a micro lens area, a lens holder formed on the substrate and over the die, a lens formed in the lens holder. A filter is formed within the lens holder and between the lens and the die, and at least one passive device formed on the substrate and covered within the lens holder. Conductive bumps or LGA (leadless grid array) are formed on the bottom surface of the substrate.

Image sensor module

An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Image sensor with a protection layer

The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Image sensor module having build-in package cavity and the method of the same

The present invention discloses a structure of package including: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

Semiconductor image device package with die receiving through-hole and method of the same

An image sensor multi-chips package structure, includes a first package including a first chip with image sensors having first bonding pads and micro lens on a first active surface, a first die receiving window and first conductive inter-connecting through holes penetrated from a first upper contact pads on a first upper surface of the first chip to a first lower contact pads on a first lower surface of the first chip, wherein a first upper build up layer on the active surface of the first chip coupling from the first bonding pads to the first upper contact pads; a second package comprising a second chip having second bonding pads on a second active surface, a second die receiving window and second conductive inter-connecting through holes penetrated from a second upper contact pads of a second upper surface of the second chip to a second lower contact pads on a second lower surface of the second chip, wherein a second upper build up layers on the second upper surface for coupling from the second bonding pads to the second upper contact pads, and second lower build up layers under the second lower surface for coupling from the second lower contact pads to terminal pads located under the second lower surface; and inter-connecting structures coupled between the first lower contact pads to the second upper contact pads.

Sensor module package structure and method of the same

The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Semiconductor device protective structure and method for fabricating the same

The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer layer is filled with the corresponding recesses to form infillings on adjacent the semiconductor device package. Dicing the wafer into individual package along substantial center of said infillings, the step may avoid the roughness on the edge of each die and also decrease the cost of the separating process.

Wafer street buffer layer

The method of forming image sensor protection comprises attaching a glass on a tape and scribing the glass with lines to define cover zones on the glass, the glass is then break by a rubber puncher followed by forming glue on the edge of the cover zones. The glass is bonded on a wafer with an image sensor to align the cover zones to a micron lens area of the image sensor, and then the tape is removed from the wafer, thereby forming glass with cover zones on the image sensor.

Method for image sensor protection

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

Growing community of inventors

Jhudong, Taiwan

Jui-Hsien Chang