Industrial Technology Research Institute

Jui-Feng Hung

Ra-Min Tain

Ming-Ji Dai

Heng-Chieh Chien

Ming-Che Hsieh

John H Lau

By adding particles of high thermal conductivity and low thermal expansion coefficient into the copper as a composite material and filling with the composite material into the through-via hole, the mismatch of the coefficient of thermal expansion and the stress of the through-silicon via are lowered and the thermal conductivity of the through-silicon via is increased.

Growing community of inventors

Taichung, Taiwan

Jui-Feng Hung