Taiwan Semiconductor Manufacturing Comp. Ltd.

Weltrend Semiconductor Inc.

Jui-Chang Chuang

Kuo-Chin Chang

Chang-Jung Hsueh

Wei-Hung Lin

Chih-Chiao Tsai

Kuan-Min Wang

A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Package structure having lid with protrusion and manufacturing method thereof

A synchronous rectifier controller controls a rectification power switch connected in series with a secondary winding between two power lines. The synchronous rectifier has a gate driver and a slew-rate detector. The gate driver drives the rectification power switch. The slew-rate detector detects a channel voltage of the rectification power switch, checks if a slew rate of the channel voltage exceeds a slope threshold. If the slew rate exceeds the slope threshold, the slew-rate detector turns the rectification power switch ON through the gate driver. If the slew rate is less than the slope threshold, the slew-rate detector reduces the slope threshold.

Synchronous rectifier controllers with slew-rate detector

Growing community of inventors

Hsinchu, Taiwan

Jui-Chang Chuang