Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Jui-Chang Chuang

Chih-Chia Chang

Kai-Ming Chang

Chen-Chu Tsai

Yen-Ting Wu

Ting-Hsun Cheng

Cheng-Chung Lee

Chyi-Ming Leu

Shih-Ming Chen

Kuang-Jung Chen

Yung-Hui Yeh

Ming-Huan Yang

Chao-Jen Wang

Sheng-Po Wang

Chen-Tsai Yang

Li-Ching Wang

Yi-Cheng Lu

Kuang-Ching Fan

Ko-Chin Yang

Chia-Hua Lu

Cheng-Yueh Chang

A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.

Physiological sensor device and system, and correction method

An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Impact resistant structure and electronic device

An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 &#x3bc;m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Protective structure and electronic device with the same

A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Chip package structure

According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.

Flexible electronic device

A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.

Protective structure having anti-scratch layer

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Kaohsiung, Taiwan

Jui-Chang Chuang