Samsung Electronics Co., Ltd.

Juhyeon Kim

Hyoeun Kim

Sunkyoung Seo

Bong-Soo Kim

Wonil Lee

Youngkun Jee

A semiconductor package includes a first semiconductor chip including a first substrate and a first bonding layer disposed on the first substrate, and having a flat first outer surface provided by the first bonding layer; and a second semiconductor chip disposed on the first outer surface of the first semiconductor chip, including a second substrate and a second bonding layer disposed on the second substrate, and having a flat second outer surface provided by the second bonding layer and contacting the first outer surface of the first semiconductor chip. The first bonding layer includes a first outermost insulating layer providing the first outer surface, a first internal insulating layer stacked between the first outermost insulating layer and the first substrate, first external marks disposed in the first outermost insulating layer and spaced apart from each other, and first internal marks interlaced with the first external marks within the first internal insulating layer.

Semiconductor chip and semiconductor package including bonding layers having alignment marks

A semiconductor package may include a redistribution substrate, a first semiconductor chip on the redistribution substrate, and a second semiconductor chip between the redistribution substrate and the first semiconductor chip. The second semiconductor chip may have a width in a first direction that is smaller than a width of the first semiconductor chip in the first direction. The first semiconductor chip may include a first alignment key pattern on a bottom surface thereof. The second semiconductor chip may be spaced apart from the first alignment key pattern. The second semiconductor chip may include a second interconnection layer on the bottom surface of the first semiconductor chip, a second semiconductor substrate on a bottom surface of the second interconnection layer and exposing a bottom surface of an edge region of the second interconnection layer, and a second alignment key pattern on the edge region of the second interconnection layer.

Semiconductor packages

A method of manufacturing a semiconductor package includes preparing a wafer structure having a first semiconductor substrate and a plurality of first front surface connection pads. A lower semiconductor chip having a preliminary semiconductor substrate and a plurality of second front surface connection pads are attached to the wafer structure such that the plurality of first front surface connection pads and the plurality of second front surface connection pads correspond to each other. A plurality of bonding pads is formed by bonding together the plurality of first front surface connection pads and the plurality of second front surface connection pads corresponding to each other. A second semiconductor substrate having a horizontal width that is less than that of the second wiring structure is formed by removing a portion of the preliminary semiconductor substrate.

Semiconductor package and method of manufacturing the same

Provided is a semiconductor package including a redistribution substrate, a connection substrate on the redistribution substrate, the connection substrate having an opening that penetrates the connection substrate, a semiconductor chip in the opening of the connection substrate, and a molding layer that covers the semiconductor chip and the connection substrate, and fills a space between the semiconductor chip and the connection substrate, the connection substrate includes a base layer, a plurality of vias that vertically penetrate the base layer, a plurality of first patterns on a top surface of the base layer and connected to the plurality of vias, and a plurality of second patterns on a bottom surface of the base layer and connected to the plurality of vias, an extension of the molding layer extends into a plurality of holes that are spaced apart from the plurality of vias and are formed to vertically penetrate the base layer.

Growing community of inventors

Cheonan-si, South Korea

Juhyeon Kim