Synopsys, Inc.

Juhwan Kim

Daniel Zhang

Lawrence S Melvin, Iii

Weiping Fang

Hua Song

Zong Wu Tang

Keun-Young Kim

Gang Huang

Haiqing Wei

Zongwu Tang

One embodiment provides a system for using a database to quickly identify a manufacturing problem area in a layout. During operation, the system receives a first check-figure which identifies a first area in a first layout, wherein the first area is associated with a first feature. Next, the system determines a first sample using the first check-figure, wherein the first sample represents the first layout's geometry within a first ambit of the first check-figure, wherein the first sample's geometry is expected to affect the shape of the first feature. The system then performs a model-based simulation using the first sample to obtain a first simulation-result which indicates whether the first feature is expected to have manufacturing problems. Next, the system stores the first simulation-result in a database which is used to quickly determine whether a second feature is expected to have manufacturing problems.

Method and apparatus for using a database to quickly identify and correct a manufacturing problem area in a layout

Mask shops typically use carbon to repair any clear defects identified on a mask, irrespective of the type of mask. However, carbon can have different characteristics than the original patterning material on the mask. Therefore, a mask that is repaired using carbon may not optically perform as if it were defect-free. An automated method of repairing a clear defect on an attenuated phase shifting mask (PSM) provides an optimized plug size/shape. In this method, a repair solution to the clear defect can be simulated, thereby allowing the repair decision for an attenuated PSM to be advantageously made at the same time that inspection is done and before actual repair. Simulation can include performing model-based OPC on the repair solution.

Simulation based PSM clear defect repair method and system

A method for performing layout verification involves identifying feature centerlines in a mask layout, and then performing lithography simulation along the centerlines to generate a set of intensity distributions. At each local maxima or minima in the intensity distributions, further lithography simulation can be performed to determine an exposure pattern width at those local maxima/minima (check positions). The exposure pattern widths can then be evaluated to determine whether an actual pinch or bridge defect will be generated at those locations. If defect generation is likely (based on the lithographical simulation) at a particular location, the corresponding portion of the mask layout can be redesigned to avoid defect generation during actual production. In this method, accurate layout verification can be performed with a minimum of time-consuming lithography modeling.

Centerline-based pinch/bridge detection

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Pleasanton, CA, United States of America

Juhwan Kim