Tactotek Oy

Juhani Harvela

Mikko Heikkinen

Jarmo Sääski

Tomi Simula

Vinski Bräysy

Pasi Raappana

Juha-Matti Hintikka

Minna Pirkonen

Tuomas Heikkilä

Antti Keränen

An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.

Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node

Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.

Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement

An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.

An electronic device includes a housing, or a 'cover', the housing material molded into a desired target shape and to at least partially embed a plurality of functional elements and an enabling arrangement, optionally at least partially embedded in the housing, the enabling arrangement including: a first connector with a first plurality of connecting elements to establish a connection between the plurality of functional elements and the enabling arrangement, a second connector with one or more second connecting elements to be connected a host device utilizing the functionalities associated with the functional elements, a memory for storing and retrieval of instructions, and processing elements capable of transforming signals from a one known format to another predetermined format according to stored instructions. A corresponding method is presented.

Growing community of inventors

Oulunsalo, Finland

Juhani Harvela