Intel Corporation

Tamglass Engineering Oy

Uniglass Engineering Oy

Juha Paavola

Mark Charles Carbone

Jeff Ku

Prakash Kurma Raju

Justin Michael Huttula

Mikko Antero Makinen

Gustavo Fricke

Jukka H Vehmas

Shantanu Dattatraya Kulkarni

Christopher M Moore

Aleksander Magi

Arnab Sen

Columbia Mishra

Evan Piotr Kuklinski

Hari Shanker Thakur

Naoki Matsumura

Vivek Paranjape

Prasanna Pichumani

Gavin Sung

Todd L Smith

Lance Lin

Kathiravan D

Jason Y Jiang

Ruander Cardenas

Gerry Juan

Ritu Bawa

Antti-Jussi Numminen

Kari Mansukoski

Min Suet Lim

David W Browning

James M Okuley

Prosenjit Ghosh

Daniel J Ragland

Bijendra Singh

Shawn S Mceuen

Tim Liu

Samarth Alva

Hua Yang

Kannan G Raja

Gokul V Subramaniam

Erkki Nokkonen

Jerrod Peterson

Baomin Liu

Tongyan Zhai

Xiyong Tian

Praveen Vishakantaiah

Jia Yan Go

Twan Sing Loo

Bala P Subramanya

Mark Macdonald

Satyajit Siddharay Kamat

Chin Kung Goh

Javed Shaikh

Nicholas R Weber

Eric Erike

Ellann Cohen

Nehakausar Shaikh Ramjan Pinjari

Sami Markus Heinisuo

Monica Maria Conejo Herrera

Luis Diego Jimenez Sanchez

Srinivas Rao Konakalla

Wan Yu Liu

Melissa Gregg

Fredrik Hamberger

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Nagaraj K

Remi Bergmann

Hannu Luoma

Kari Vallius

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Cora Nien

Curtis Koepsell

Methods, apparatus, systems, and articles of manufacture to increase stacking pressure in battery cells are disclosed. A disclosed battery includes an anode layer and a cathode layer stacked with the anode layer. The disclosed battery further includes a tension bearing structure to extend through at least one of the anode layer or the cathode layer.

Methods and apparatus to increase stacking pressure in battery cells

Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

Cooling systems with heat pipes for electronic devices

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

Thermal solution as an effective EMI shield

Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.

Removable fan cartridges for electronic devices

Metal is extruded through a feeder plate and an extrusion die to form a heat pipe component that includes a length of pipe and a flange extending outward from the pipe along the length of the pipe. A section of the flange is removed from the extruded heat pipe component, the pipe is sealed and compressed to reduce its thickness and form a heat pipe element for a computing system.

Extruded heat pipe

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

Heat pipe for improved thermal performance at cold plate interface

Modular electronic device

Computing devices and peripherals having a dynamic curvature are disclosed. The base of a laptop can curve as the laptop lid is opened due to left and right base portions being pulled inward to a bisector of the base. Base portions can be pulled inwards by a bending strap pushed upwards by a lifter spring, by base hinges that rotate inwards, or a shape memory allow wire laced around pulleys that contract when heated. A display device with dynamic curvature can curve due to a rack and pinion linear actuator that extends or shortens adjustable rods housed in the display support. A base or display can be curved based on the context of the computer device or in response to certain events. The curvature of a base or display can be tunable by a user. Curved bases and displays can reduce wrist and eye strain.

Dynamic curvature devices and peripherals

thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

Thermal management systems having signal transfer routing for use with electronic devices

Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.

Thermally conductive shock absorbers for electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

Heatsink with a sandwich plate construction

Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.

Personal computing device covers having stands

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.

Vapor chambers

Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.

Fan support

Growing community of inventors

Hillsboro, OR, United States of America

Juha Paavola