Stora Enso Oyj

Oy Keskuslaboratorio-Centrallaboratorium Ab

Digital Tags Finland, Oy

Juha Maijala

Petri Sirviö

Raimo Mäkelä

Petri Ilkka

Petri Sirvio

Lauri Huhtasalo

Juha Merta

Tommi Jokinen

Sanna Lehti

Petri SirviÖ

Method and apparatus for producing RFID transponders () arranged on a carrying substrate, comprising:providing a first substrate (), the first substrate having at least one antenna element () arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (), the second substrate () having at least one RFID strap, each RFID strap comprising an IC () and at least one contact pad () coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element () on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.

Method and an apparatus for producing a radio-frequency identification transponder

A system for monitoring the life cycle of a product even in open-loop retail environment having regard to the associated supply or value chain, comprising tag provision equipment arranged to obtain product information and to configure a wirelessly interrogatable electronic identification tag provided with externally readable identification information to a product item, wherein configuring incorporates at least partially automated determination, according to predefined decision logic, of at least one technical characteristic of tag implementation based on the product information to optimize the operation of the tag, and electronic data management system accessible via a communications network, preferably the Internet, comprising a data interface configured to receive and transmit data, and a data repository configured to store indications of received digital notifications of tag reading events in a plurality of activities of the associated supply or value chain, said notifications conveying said tag identification information. A corresponding method for execution by the system is presented.

System and method for tracking products in open-loop supply or value chain

A method () for producing an electrically conductive pattern on substrate (), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (), where the pattern () comprises a contact area (B) for connecting to an electronic component and a conductive structure (A) having at least a portion () adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substantially equal.

Method and an arrangement for producing electrically conductive patterns on substrates

A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

Method and arrangement for attaching a chip to a printed conductive surface

Apparatus () for component positioning comprises at least one receptacle () configured to receive a number of components () to be placed on a target substrate (), agitator () configured to exert force impulses, such as abrupt force impulses, on the receptacle so as to cause the components to change their position inside the receptacle, inspection equipment () configured to verify the position of the components inside the receptacle, and pick and place equipment () configured to pick one or more components from the receptacle that fulfil a predefined position criterion and place the components on the target substrate. A related method for component positioning is presented.

Apparatus and method for component positining

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Versatile and reliable intelligent package

A monitoring system for monitoring smart package content use, wherein the system comprises a smart package. The smart package in turn comprises removable content units, such as pill type or tablet type or other singly packed objects, as well as most preferably wireless communication elements. The system comprises also database elements with which the smart package can be in communication. In addition, the smart package is adapted to detect said removal of a content unit and to deliver information to said database elements by way of said communication elements, regarding a removal of said content unit. The smart package is identifiable by the database elements on the basis of information delivered by way of said communication elements.

Monitoring system for monitoring smart package content use

A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Arrangement for producing an electrically conductive pattern on a surface

A smart package backing () for pills removable from the backing, wherein the backing is adapted to record a removal of said pills by means of detection elements (). The detection elements comprise electrical components (), wherein said electrical components are pressed onto the backing () with methods of printing technology. The removal of a pill from the backing is adapted to bring about a structural change in at least one printed component, and the structural change of said component is adapted to bring about an electrically measurable change in an electric circuit comprising said component. In addition, at least one of said electrical components () deviates in terms of its specific electrical value from the specific electrical value of at least one other electrical component ().

Smart package and method for manufacturing the package

Method for producing an electrically conductive pattern on a surface

A fiber or plastic based package includes: an interface adapted to attach and connect, in a detachable manner, a module to a fiber or plastic based package, the module including a wireless transmitter, and the interface including conductors for transferring package data from the fiber or plastic based package to the module. A module, system and software are also implemented in connection with the fiber or plastic based package. A smart package, its management and various applications thereof are provided.

Fiber or plastic based package, apparatus, method, program and system for wireless data communication by fiber or plastic based package

The invention concerns a method for forming an electrically conductive pattern on an insulating substrate. In the method, particle-type electrically conductive matter is transferred onto a surface of the substrate and the particle-type electrically conductive matter is at least partially sintered at elevated temperature and pressure in order to convert the particle-type electrically conductive matter into a continuously electrically conductive pattern affixed to the substrate. According to the invention, the electrically conductive matter is transferred in the form of a predefined pattern, and the sintering is carried out by using a nip comprising two opposing nip members between which the substrate is fed. The method provides an efficient way of making high-resolution conductor structures at low temperatures.

Growing community of inventors

Espoo, Finland

Juha Maijala