Digital Tags Finland, Oy

Confidex Oy

Juha Ikonen

Lauri Huhtasalo

Heikki Ahokas

Marko Hanhikorpi

Matti Ritamäki

Jarkko Miettinen

Lari Kytölä

Eerik Halonen

The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.

RFID label

Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.

Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna

The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

Method for manufacturing products comprising transponders

Growing community of inventors

Nokia, Finland

Juha Ikonen