Asm Technology Singapore Pte Ltd

Juergen Roland Betz

Karel Maykel Richard Van Der Stam

Guido Martinus Henricus Knippels

Mark Christian Mueller

A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.

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Bad Kreuznach, Germany

Juergen Roland Betz