Epcos Ag

Snaptrack Incorporated

Rf360 Singapore Pte. Ltd.

Juergen Portmann

Hans Krueger

Alois Stelzl

Christian Bauer

Wolfgang Pahl

Stefan Leopold Hatzl

Robert Koch

Peter Selmeier

Manuel Hofer

Jeroen Bielen

Xavier Perois

Karl Nicolaus

Michael Wick

A multi-level stacked AW filter package including a first acoustic wave (AW) filter stacked on a second AW filter employs semiconductor fabrication methods and structures, including a metallization layer comprising interconnects to couple a contact surface to the second AW filter. Each AW filter includes an AW filter circuit on a semiconductor substrate. A second substrate disposed on a frame on the substrate protects the AW filter circuit. In a multi-level AW filter package, the second substrate of the first AW filter comprises a glass substrate with a similar expansion rate as the semiconductor substrate. The interconnects coupling the second AW filter to the contact surface are disposed on insulators on the side wall surfaces of the semiconductor substrates of the first AW filter for isolation. In a stacked AW filter package comprising a single AW filter, the interconnects couple the contact surface to the AW filter.

Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods

A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

Wafer-level package and method for production thereof

A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

Component and method for producing a component

Frames () applied on a wafer () are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (), in particular for filter or MEMS structures. Inner columns () can be provided for supporting the housing and for the ground connection; outer columns () can be provided for the electrical connection and are connected to the component structures by means of conductor tracks () that are electrically insulated from the frames ().

Hermetically sealed housing for electronic components and manufacturing method

A component includes a carrier substrate having a coefficient of thermal expansion &#x3b1;and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion &#x3b1;in a first direction xand a first expansion difference, &#x394;&#x3b1;equal to the absolute value of &#x3b1;&#x2212;&#x3b1;. The chip also has a second coefficient of thermal expansion &#x3b1;in a second direction xand a second expansion difference &#x394;&#x3b1;is equal to the absolute value of &#x3b1;&#x2212;&#x3b1;,. The bumps are arranged such that a first distance, &#x394;x, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction xis less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x.

Electric component with a flip-chip construction

Growing community of inventors

Munich, Germany

Juergen Portmann