Epcos Ag

Snaptrack Incorporated

Juergen Kiwitt

Maximilian Pitschi

Andreas Fleckenstein

Robert Koch

Christian Bauer

Andreas Przadka

Luigi Rosetti

An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Electrical component

A stable electrical component includes a carrier substrate and a chip () mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged between the carrier substrate and the chip. The reactance element is at least partly realized by means of at least one conductor track. The reactance element includes a coil, a capacitor or a transmission line.

Electrical Component

An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.

Electrical component for the front end circuit of a transceiver

A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Substrate with embedded signal line and ground planes with a slot therein

A component operating with acoustic waves is described herein. The component includes a substrate having an underside subdivided into a center area and an edge area surrounding the center area on all sides. The component also includes a plurality of outer terminals in the edge area, and a plurality of inner terminals in the center area comprising at least a first inner terminal configured as a signal terminal.

Component operating on acoustic waves

A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure, or has a different layer thicknesses for at least one layer in comparison to the second filter.

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Munich, Germany

Juergen Kiwitt