Intel Corporation

Juergen D Felleisen

Michael Windig

Talal Arnaout

A stability device comprising a carrier having a first socket and a second socket; a first circuit board inserted into the first socket; a second circuit board inserted into the second socket, wherein an inside surface of the second circuit board is facing an inside surface of the first circuit board; a center structure positioned between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure is fixed to the carrier via a stability bar fixed to the carrier; a spring loaded outer structure at least partially surrounding an outside surface of the first circuit board and an outside surface of the second circuit board and to fix the center structure between the inside surface of the first circuit board and the inside surface of the second circuit board, wherein the center structure and outer structure dissipate heat.

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Baden-Baden, Germany

Juergen D Felleisen